MRAM Shielding Housing Structure for External Magnetic Field Immunity
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Magnetoresistive random access memory (MRAM) chips are susceptible to external magnetic fields, leading to increased bit-error rates and fabrication difficulties due to strict requirements on spin-transfer-torque efficiency.
Innovation Solution
A semiconductor package design featuring a shielding housing made of magnetic permeable materials with a raised portion and a flat portion, encasing the MRAM chip to redirect and reduce external magnetic fields, thereby improving magnetic immunity and allowing for more flexible fabrication targets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If MRAM chip is exposed to external magnetic fields, then magnetic field interaction occurs, but bit-error rate increases and fabrication becomes difficult
Solution Approach 1:
A shielding housing made of magnetic permeable material is introduced as an intermediary between the external magnetic field and the MRAM chip. The shielding housing redirects and reduces external magnetic fields, preventing them from directly interacting with the MRAM chip, thereby lowering bit-error rates and improving reliability without affecting fabrication processes
2Reliability
If strict requirements on spin-transfer-torque efficiency are imposed, then MRAM performance is improved, but fabrication complexity increases
Solution Approach 1:
The shielding housing provides preliminary protection against external magnetic fields before they can affect the MRAM chip during operation. This preliminary anti-action reduces the impact of magnetic fields on the chip, allowing for more flexible fabrication targets and reducing fabrication complexity while maintaining performance
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The shielding housing reduces the external magnetic field's impact on the MRAM chip by more than 50%, lowering bit-error rates and enhancing the chip's magnetic immunity, thus optimizing operation and reducing fabrication complexity.
Implementation Method 1
A semiconductor package design featuring a shielding housing made of magnetic permeable materials with a raised portion and a flat portion, encasing the MRAM chip to redirect and reduce external magnetic fields
Data Source
AI summary
A semiconductor package, a semiconductor device and a shielding housing for a semiconductor package are provided. The semiconductor package includes a semiconductor chip having a first region and a second region beside the first region; and a shielding housing encasing the semiconductor chip, made of a magnetic permeable material, and including a first shielding plate, a second shielding plate opposite to the first shielding plate and a shielding wall extending between the first shielding plate and the second shielding plate. The first shielding plate has an opening exposing the first region and includes a raised portion surrounding the opening and a flat portion beside the raised portion and shielding the second region. A first distance from a level of the semiconductor chip to an outer surface of the raised portion is greater than a second distance from the level to an outer surface of the flat portion.