MRAM Shift-Adjustment Layer Segmentation for Etching
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Solution Overview
Problem
Miniaturization of magnetoresistive random access memories (MRAM) using magnetic tunnel junction (MTJ) elements poses challenges in processing due to the need for increased thickness of the shift-adjustment layer, which complicates ion beam etching and other processing techniques.
Innovation Solution
The magnetoresistive memory device incorporates a shift-adjustment layer with an artificial lattice structure, such as alternately laminated Co and Pt, which extends to connect top electrodes and functions as both a shift-cancellation layer and a bit line, allowing for easier processing and maintaining a sufficient shift-cancellation effect even at reduced MTJ element thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the MTJ element is miniaturized, then the storage capacity increases, but the thickness of the shift-adjustment layer must be increased which complicates processing
Solution Approach 1:
The shift-adjustment layer is segmented into multiple thin layers (e.g., CoFeB and Ru layers) rather than using a single thick layer. This segmentation allows the total thickness to be achieved through multiple deposition steps, making the processing manageable even for miniaturized MTJ elements where a large total thickness is required for sufficient shift cancellation.
Solution Approach 2:
The patent transitions from a single-layer thickness parameter to a multi-layer stack configuration. By using alternating magnetic and non-magnetic layers, the solution moves from controlling a single dimensional parameter (thickness) to controlling multiple parameters (layer thicknesses, materials, and sequences), thereby resolving the processing difficulty while achieving the required effective thickness.
2Object-affected harmful factors
If the shift-adjustment layer is made thick to suppress stray magnetic fields, then the shift-cancellation effect improves, but ion beam etching and other processing become difficult
Solution Approach 1:
The thick shift-adjustment layer is divided into multiple thin alternating layers of magnetic material (e.g., CoFeB) and non-magnetic material (e.g., Ru). This segmentation enables each thin layer to be deposited and processed separately, making ion beam etching and other processing steps feasible while maintaining the total thickness required for effective stray field suppression.
Solution Approach 2:
The patent uses composite material structures with alternating magnetic (CoFeB) and non-magnetic (Ru) layers. This composite structure provides both the magnetic properties needed for shift cancellation and the structural characteristics that facilitate processing, as the non-magnetic layers act as etch stop layers and the thin magnetic layers can be precisely controlled.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables efficient processing and maintains a shift-cancellation effect, facilitating the miniaturization of MTJ elements while simplifying etching procedures and ensuring effective suppression of stray magnetic fields.
Implementation Method 1
a magnetic layer provided on the top electrode, the magnetic layer extending on the insulating film to connect a plurality of those of the top electrodes
Implementation Method 2
there is a case where the MTJ element further comprises a shift-adjustment layer to suppress the influence of a stray magnetic field from the reference layer
Implementation Method 3
large-capacity magnetoresistive random access memories (MRAM) using a magnetic tunnel junction (MTJ) element
Data Source
AI summary
According to one embodiment, a magnetoresistive memory device includes bottom electrodes provided on a substrate, a magnetoresistive element provided on each of the bottom electrodes, a top electrode provided on each of the magnetoresistive elements, an insulating film provided on sides of the bottom electrode, the magnetoresistive element and, the top electrode, and a magnetic layer provided on the top electrode, the magnetic layer extending on the insulating film to connect a plurality of those of the top electrodes.


