MRI Thermal Shield Vibration Reduction via Linking Members

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Solution Overview

Problem

Magnetic resonance imaging (MRI) systems face issues with thermal shield vibrations due to eddy currents induced by gradient coil pulsed currents, leading to excessive heat generation and potential magnet quenching from cryogen boil-off.

Innovation Solution

The introduction of linking members to mechanically connect the thermal shield assembly with the coil former, increasing mechanical rigidity and reducing vibrations caused by eddy currents interacting with the magnetic field.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If the thermal shield assembly is made of metal materials to prevent heat radiation, then thermal insulation performance is improved, but eddy current is induced causing Lorentz force and vibrations

Engineering Contradiction:
Improvethermal insulation performanceVSAvoideddy current induced vibrations
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent applies composite materials by combining metal thermal shield components with non-metallic damping materials. The damping treatment layer is applied to the metal thermal shield, creating a composite structure that maintains the metal's thermal shielding function while adding vibration damping capabilities to reduce eddy current-induced vibrations.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the physical and mechanical parameters of the thermal shield assembly by applying damping treatments that modify the material properties. This includes changing the structural parameters through coating applications that alter the resonant frequencies and damping characteristics of the metal components, thereby reducing vibrations without compromising thermal performance.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If the thermal shield assembly is made of metal materials to prevent heat radiation, then thermal insulation performance is improved, but excessive heat is generated on the main magnet causing cryogen boil-off

Engineering Contradiction:
Improvethermal insulation performanceVSAvoidcryogen boil-off
Core Design Contradiction:
TemperatureVSLoss of energy

Solution Approach 1:

The patent applies composite materials by combining metal thermal shield components with non-metallic damping materials. The damping treatment layer is applied to the metal thermal shield, creating a composite structure that maintains the metal's thermal shielding function while adding vibration damping capabilities to reduce eddy current-induced vibrations.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the physical and mechanical parameters of the thermal shield assembly by applying damping treatments that modify the material properties. This includes changing the structural parameters through coating applications that alter the resonant frequencies and damping characteristics of the metal components, thereby reducing vibrations without compromising thermal performance.

Inventive Principle:
Principle #35Parameter changes

3Temperature

If the thermal shield assembly is made of metal materials to prevent heat radiation, then thermal insulation performance is improved, but magnet quenching may occur

Engineering Contradiction:
Improvethermal insulation performanceVSAvoidmagnet stability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The patent applies composite materials by combining metal thermal shield components with non-metallic damping materials. The damping treatment layer is applied to the metal thermal shield, creating a composite structure that maintains the metal's thermal shielding function while adding vibration damping capabilities to reduce eddy current-induced vibrations.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent changes the physical and mechanical parameters of the thermal shield assembly by applying damping treatments that modify the material properties. This includes changing the structural parameters through coating applications that alter the resonant frequencies and damping characteristics of the metal components, thereby reducing vibrations without compromising thermal performance.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces thermal shield vibrations, minimizing heat generation and preventing excessive cryogen boil-off, thereby avoiding magnet quenching in MRI systems.

Implementation Method 1

eddy current will be induced on at least a part of the body of the thermal shield when a gradient coil assembly of the MRI system is driven by pulsed current signals

Methodology Applied
Scientific EffectEddy current: Eddy Currents

Implementation Method 2

The induced eddy current interacts with the main magnetic field and produces significant Lorentz force on the thermal shield

Methodology Applied
Scientific EffectLorentz force: Lorentz Force

Implementation Method 3

The linking member is configured for increasing mechanical rigidity of the thermal shield assembly by mechanically linking at least a part of the thermal shield assembly with the coil former

Methodology Applied
Scientific EffectMechanical rigidity:

Data Source

PatentUS10416254B2System for reducing thermal shield vibrations
Publication Date: 2019.09.17 GENERAL ELECTRIC CO
  • US10416254B2 patent drawing
  • US10416254B2 patent drawing
  • US10416254B2 patent drawing

AI summary

A magnetic resonance imaging system includes at least one gradient coil, at least one coil former, a thermal shield assembly, and at least one linking member. The at least one gradient coil generates at least one gradient field along at least one direction in response to pulsed signals. The at least one coil former is attached with at least one coil. The thermal shield assembly is arranged adjacent to the at least one coil former. The at least one linking member is configured for increasing mechanical rigidity of the thermal shield assembly by mechanically linking at least a part of the thermal shield assembly with the at least one coil former. As a result, mechanical vibrations of the thermal shield assembly can be reduced.