Magnetic Tunnel Junctions with Terbium Insertion Layers

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Solution Overview

Problem

Integrated circuits with magnetic tunnel junctions (MTJs) face challenges in achieving high thermal stability and reduced switching currents, which are crucial for efficient operation and robustness, especially during thermal events like soldering reflow.

Innovation Solution

Incorporating a non-magnetic terbium layer in the MTJ stack, either as a transition layer or an insertion layer, enhances thermal inertness and stability, allowing the MTJ to maintain magnetic properties at higher temperatures and improve tunnel magnetoresistance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If traditional MTJ stacks are used without terbium layers, then the device structure is simpler and manufacturing is easier, but thermal stability degrades at high temperatures causing demagnetization

Engineering Contradiction:
Improvethermal stabilityVSAvoidMTJ stack structure
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces terbium-containing layers (transition layer or insertion layer) into the MTJ stack structure, creating a composite material system that combines traditional magnetic layers with terbium-based non-magnetic layers to achieve enhanced thermal stability while maintaining the required magnetic properties

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The terbium-containing transition layer or insertion layer acts as an intermediary between magnetic layers, providing thermal stability and magnetic coupling functionality. This intermediary layer enables the system to withstand high temperatures during soldering reflow while maintaining proper magnetic layer coupling

Inventive Principle:
Principle #24Intermediary (Mediator)

2Reliability

If higher PMA values are achieved in the free layer, then tunnel magnetoresistance and switching efficiency improve, but thermal inertness decreases making the MTJ vulnerable to demagnetization

Engineering Contradiction:
Improvetunnel magnetoresistanceVSAvoidthermal inertness
Core Design Contradiction:
ReliabilityVSStability of the object's composition

Solution Approach 1:

The terbium-containing insertion layer positioned between free layers acts as an intermediary that provides thermal stability to the high PMA free layers. This mediator layer enables the free layers to maintain high perpendicular magnetic anisotropy for improved TMR while being protected from thermal demagnetization during high-temperature processing

Inventive Principle:
Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates a composite structure where terbium-based non-magnetic layers are combined with high PMA magnetic layers, achieving a synergistic effect where the terbium layers provide thermal stability while the magnetic layers provide high TMR through enhanced perpendicular magnetic anisotropy

Inventive Principle:
Principle #40Composite materials

3Reliability

If the free layer is designed for high thermal stability, then resistance to demagnetization improves, but the current required for programming increases reducing efficiency

Engineering Contradiction:
Improvethermal robustnessVSAvoidprogramming current
Core Design Contradiction:
ReliabilityVSUse of energy by moving object

Solution Approach 1:

The terbium-containing transition layer or insertion layer serves as a mediator that enables thermal stability without increasing programming current requirements. The terbium layers provide thermal protection while maintaining magnetic coupling efficiency, allowing low-current programming of the free layer magnetization state

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The use of terbium in non-magnetic layers within the MTJ stack increases thermal robustness, enabling the MTJ to withstand higher temperatures and maintain data integrity, thus improving the overall efficiency and reliability of the integrated circuit.

Implementation Method 1

The magnetic properties of the free layer may be changed when the memory cell is programmed, where the alignment of the free layer magnetic properties is changed relative to the fixed layer magnetic properties in the programming process. Programming changes the magnetic properties of the free layer and the fixed layer from anti-parallel to parallel, or from parallel to anti-parallel.

Methodology Applied
Scientific EffectThermal inertness:

Implementation Method 2

If the pinned layer and the free layer have parallel magnetic poles, the resistance through the MTJ stack is measurably less than if the pinned layer and the free layer have anti-parallel poles, so parallel magnetic poles may be read as a '0' and anti-parallel poles may be read as a '1'.

Methodology Applied
Scientific EffectMagnetoresistance: Magnetoresistance

Implementation Method 3

The free layer of the MTJ stack has a perpendicular magnetic anisotropy (PMA) value, and higher PMA values improve the operation of the MTJ stack. For example, higher PMA values can increase the difference in resistance of the MTJ stack between the parallel and anti-parallel states. Also, higher PMA values can decrease the required current to program the free layer.

Methodology Applied
Scientific EffectPerpendicular magnetic anisotropy: Anisotropy

Data Source

PatentUS10475495B2Integrated circuits with magnetic tunnel junctions and methods of producing the same
Publication Date: 2019.11.12 GLOBALFOUNDRIES SINGAPORE PTE LTD
  • US10475495B2 patent drawing
  • US10475495B2 patent drawing

AI summary

Integrated circuits and methods of producing the same are provided. In an exemplary embodiment, an integrated circuit includes a magnetic tunnel junction stack. The magnetic tunnel junction stack includes a first free layer that is magnetic, a second free layer that is magnetic, and an insertion layer positioned between the first and second free layers. The insertion layer is non-magnetic, and the insertion layer includes terbium.