μ-LED Array Luminescence Detection Without Physical Probes
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Solution Overview
Problem
Existing μ-LED display technologies face challenges in mass detection due to increased inspection time and potential damage from traditional probe methods, especially for units smaller than 10 microns, leading to high costs and inefficiencies.
Innovation Solution
An apparatus and method utilizing a translucent conductive substrate and common pad layer to electrically connect μ-LED units, combined with image analysis, simulation, and calibration to measure brightness without physical contact, allowing for non-destructive quality inspection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If traditional probe measurement methods are used to inspect μ-LED units, then electrical connection and brightness detection can be achieved, but inspection time increases sharply and μ-LED units may be damaged due to physical impact
Solution Approach 1:
The patent replaces the mechanical probe contact system with an optical detection system. The image analysis module captures luminescence images of the μ-LED array, and brightness values are extracted through image processing algorithms, eliminating the need for physical probe contact and significantly reducing inspection time while maintaining measurement accuracy.
Solution Approach 2:
The patent creates an optical copy (luminescence image) of the μ-LED array's emission state. By capturing the light emitted by the μ-LED units and analyzing the image data, the system obtains brightness information without physical contact, thereby avoiding mechanical damage and reducing inspection time.
2Measurement precision
If traditional probe measurement methods are used to inspect μ-LED units, then brightness detection can be performed, but μ-LED units with critical dimension less than 10 microns may be damaged due to physical impact
Solution Approach 1:
The patent replaces the mechanical probe contact system with an optical detection system. The image analysis module captures luminescence images of the μ-LED array, and brightness values are extracted through image processing algorithms, eliminating the need for physical probe contact and significantly reducing inspection time while maintaining measurement accuracy.
Solution Approach 2:
The patent introduces light (luminescence) as an intermediary between the μ-LED units and the detection system. The μ-LED units emit light that is captured by the image analysis module, allowing indirect measurement of brightness without direct mechanical contact, thereby preventing damage to fragile sub-10-micron structures.
3Manufacturing precision
If the number of μ-LED units on the wafer increases to achieve higher display resolution, then display quality improves, but the number of probes required for inspection increases leading to higher inspection cost
Solution Approach 1:
The patent creates an optical copy (luminescence image) of the μ-LED array's emission state. By capturing the light emitted by the μ-LED units and analyzing the image data, the system obtains brightness information without physical contact, thereby avoiding mechanical damage and reducing inspection time.
Solution Approach 2:
The patent employs a single imaging device that can simultaneously capture and analyze the luminescence state of all μ-LED units in the array. This universal detection approach replaces the need for individual probes for each unit, significantly reducing system complexity and inspection cost while maintaining the ability to detect brightness variations across high-resolution displays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables complete measurement of electroluminescent characteristics with reduced time and cost, ensuring μ-LED units are not damaged during inspection.
Implementation Method 1
The electroluminescent devices array is electrically conduct through the translucent conductive substrate and the common pad layer, so that each of the electroluminescent devices emits light
Implementation Method 2
uses optical detection technology to check the light-emitting state of the μ-LED units after power is supplied thereon
Data Source
AI summary
An apparatus includes a detection circuit, an image analysis module, a simulator, a calibration module and a judgment module. The detection circuit includes a translucent conductive substrate and a common pad layer electrically contacting each of the electroluminescent devices to make each of the electroluminescent devices emitting light. The image analysis module is used to capture a luminescence image of the electroluminescent devices array and obtain a measured brightness value of each of the electroluminescent devices based on the luminescence image. The simulator is used to simulate the electroluminescent devices array to obtain a theoretical brightness value of each of the electroluminescent devices. The calibration module is used to calibrate the measured brightness value and obtain a calibrated brightness value. The judgment module is used to judge a state of each of the electroluminescent devices based on a difference between the theoretical brightness value and the calibrated brightness value.