μLED Lighting Module Bonding Structure for Low Resistance and Crosstalk

The patent transitions from planar circuit routing to a three-dimensional stacked architecture. The carrier substrate is divided into multiple layers (first substrate, second substrate, third substrate) with circuit elements distributed across different vertical levels. This vertical dimensionality allows current to flow through multiple parallel conductive paths, reducing overall resistance and improving current distribution uniformity across the μLED array.

The patent implements a nested multi-layer structure where the first substrate contains first circuit elements, the second substrate contains second circuit elements, and the third substrate contains third circuit elements. These nested layers are vertically stacked and electrically connected, creating a compact three-dimensional circuit integration that reduces resistance while maintaining small form factor.

The patent segments the pixel array into independently controllable units by providing separate circuit elements on different substrates. Each μLED can be individually addressed through its dedicated circuit path, preventing signal interference between adjacent pixels. The segmentation of circuitry across multiple layers isolates electrical fields, reducing crosstalk while enabling high pixel density.

By distributing circuit elements across multiple vertical layers rather than planar arrangement, the patent increases the effective spacing between adjacent pixel circuits in the horizontal plane. This vertical separation reduces electromagnetic interference and optical crosstalk between pixels, allowing higher pixel density without quality degradation.