μLED Pixel Electrode Layout Without Chip Bonding
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The current μLED production process is inefficient due to the complex bonding process required for accurate electrical contact between μLED chips and driving electrodes, leading to low manufacturing efficiency and yield.
Innovation Solution
A μLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection, where μLED chips directly contact a lower pixel electrode, and an insulating layer prevents carrier injection through an upper pixel electrode, eliminating the need for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If traditional LED manufacturing method with pn junction growth and mechanical transfer is used, then accurate electrical contact between μLED chips and driving electrode can be achieved, but manufacturing efficiency is low and production time is long
Solution Approach 1:
The patent merges the μLED chip structure with the pixel electrode structure by integrating the n-type semiconductor layer directly with the lower pixel electrode and the p-type semiconductor layer directly with the upper pixel electrode. This eliminates the separate bonding process and achieves both electrical contact and structural integration in a single configuration, thereby improving manufacturing efficiency while maintaining electrical contact accuracy.
Solution Approach 2:
The patent extracts and eliminates the complex mechanical transfer and bonding processes from the traditional manufacturing flow. By removing these intermediate steps and directly forming the semiconductor layers on the pixel electrodes, the manufacturing process is simplified significantly, improving productivity without sacrificing electrical contact precision.
2Manufacturing precision
If traditional mechanical transfer and bonding process is used, then accurate alignment between μLED chips and driving electrode can be achieved, but device complexity increases and manufacturing cost rises
Solution Approach 1:
The patent combines the alignment function with the electrode structure design itself. By designing the pixel electrodes with appropriate patterns and dimensions that directly contact the semiconductor layers, the alignment requirement is built into the structure rather than requiring separate alignment processes, thereby reducing process complexity while maintaining alignment accuracy.
3Reliability
If dual-ended carrier injection is used with both pixel electrodes contacting μLED chips, then electrical performance can be maintained, but manufacturing process becomes complicated and yield decreases
Solution Approach 1:
The patent introduces asymmetry in the electrical contact configuration by making the lower pixel electrode contact the n-type semiconductor layer while the upper pixel electrode contacts the p-type semiconductor layer through a different mechanism. This asymmetric design simplifies the manufacturing process and improves yield while maintaining the necessary electrical performance through the alternating electric field application.
Solution Approach 2:
The patent changes the electrical injection parameters by using single-ended carrier injection where carriers are injected through only one electrode (the lower pixel electrode), while the upper pixel electrode serves primarily for field application and extraction. This parameter change simplifies the manufacturing process and improves yield while maintaining device functionality.
4Productivity
If insulating layer is added to prevent carrier injection through upper pixel electrode, then single-ended carrier injection is achieved, but device structure becomes more complex
Solution Approach 1:
The insulating layer serves multiple functions: it prevents unwanted carrier injection through the upper pixel electrode, provides electrical isolation, and maintains the structural integrity of the device. By making this single component perform multiple functions, the overall device complexity is minimized while achieving the desired single-ended carrier injection capability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution simplifies the manufacturing process, reduces production time, and increases yield, thereby enhancing the market competitiveness of μLED devices.
Implementation Method 1
the μLED chips are lit by an alternating electric field applied between the upper pixel electrode and the lower pixel electrode
Data Source
AI summary
The invention relates to a μLED light-emitting and display device with single-ended electrical contact and single-ended carrier injection, and a manufacturing method of the μLED light-emitting and display device. The μLED light-emitting and display device comprises more than one pixel unit, and each pixel unit sequentially comprises a lower pixel electrode, μLED chips, an insulating layer, and an upper pixel electrode from bottom to top, wherein the μLED chips directly contact with the lower pixel electrode, external carriers are injected into the μLED chips through the lower pixel electrode, the insulating layer prevents the external carriers from being injected into the μLED chips through the upper pixel electrode, and the μLED chips are lit by an alternating electric field applied between the upper pixel electrode and the lower pixel electrode. The invention avoids the complicated bonding process, and is expected to improve the market competitiveness of the μLED light-emitting and display device.