Mullite Wiring Board Metallization for Stronger Substrate Bonding
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Solution Overview
Problem
Existing wiring boards face challenges in enhancing the joining strength between the insulating substrate and the metallized layer while maintaining mechanical strength and dielectric constant, as conventional methods fail to effectively improve this interface.
Innovation Solution
The wiring board incorporates an insulating substrate with aluminum oxide and mullite, featuring a metallized layer with a three-dimensional metal phase and embedded glass phase, forming an interpenetrating network structure that increases the bond strength between the substrate and the metallized layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a metallized layer is formed on an insulating substrate using conventional methods, then the basic electrical connection is achieved, but the joining strength between the insulating substrate and the metallized layer is insufficient
Solution Approach 1:
The patent applies composite materials by creating a metallized layer consisting of multiple phases (metal phase, glass phase, and crystal phase) rather than using a single material. This composite structure enhances the joining strength between the insulating substrate and the metallized layer, resolving the contradiction between achieving basic electrical connection and improving interface bond reliability.
Solution Approach 2:
The patent applies local quality by creating distinct phases with different properties within the metallized layer. The glass phase provides bonding to the insulating substrate, the metal phase provides electrical conductivity, and the crystal phase enhances mechanical strength. This localized differentiation of material properties within the metallized layer resolves the contradiction between electrical connection and joining strength.
2Strength
If the insulating substrate contains only aluminum oxide, then the dielectric constant is maintained, but the mechanical strength and joining strength are limited
Solution Approach 1:
The patent applies composite materials by combining aluminum oxide with mullite in the insulating substrate. This composite composition enhances the mechanical strength and joining strength of the substrate while maintaining its dielectric properties, resolving the contradiction between mechanical strength and substrate composition simplicity.
3Strength
If the metallized layer uses a simple metal structure, then the electrical conductivity is good, but the bond strength to the substrate is insufficient
Solution Approach 1:
The patent applies composite materials by creating a metallized layer with multiple phases (metal, glass, and crystal phases) that work together to provide both strong bonding to the substrate and good electrical conductivity. This composite structure reduces signal transmission loss while enhancing bond strength, resolving the contradiction between these two requirements.
Solution Approach 2:
The patent applies local quality by creating distinct phases within the metallized layer where the glass phase provides bonding to the substrate, the metal phase provides electrical conductivity, and the crystal phase enhances mechanical strength. This localized functional differentiation resolves the contradiction between bond strength and signal transmission quality.
Data Source
AI summary
Disclosed is a wiring board, including: an insulating substrate containing aluminum oxide; and a metallized layer that includes a metal phase containing a metal material and a first glass phase containing a glass component and that is disposed on the insulating substrate. At least one of the insulating substrate and the metallized layer further contains mullite. In the metallized layer, the metal phase continues in a three-dimensional network shape, and the first glass phase is embedded between the metal phase.