Multi-Antenna Interposer Package for Compact Electronic Integration
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Solution Overview
Problem
Existing semiconductor device packages face challenges in reducing size and increasing integration while supporting advanced electronic functionality, particularly in portable devices.
Innovation Solution
The implementation of a carrier with a first interposer and multiple antenna components, where the antenna components are disposed on different surfaces and connected via connectors, allowing for efficient integration without increasing the device's size or form factor.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple antennas are integrated into a single package, then electronic functionality is enhanced, but device size increases
Solution Approach 1:
The patent implements nested packaging where a first antenna component is disposed inside a second antenna component, with the first antenna component's carrier positioned within the volume occupied by the second antenna component. This nested arrangement allows multiple antennas to coexist in a compact space, enhancing electronic functionality without proportionally increasing device volume.
Solution Approach 2:
The patent utilizes three-dimensional spatial arrangement by disposing antenna components on different surfaces of the interposer (first surface, second surface, and lateral surfaces) and using vertical stacking with the nested configuration. This multi-dimensional placement strategy maximizes space utilization, allowing multiple antennas to be integrated without significantly increasing the device's footprint or overall volume.
2Ease of manufacture
If antenna components are disposed on different surfaces of the interposer, then integration efficiency is improved, but manufacturing complexity increases
Solution Approach 1:
The patent divides the antenna system into separate antenna components (first antenna component and second antenna component), each with its own carrier and conductive patterns, which are then integrated onto different surfaces of the interposer. This segmentation allows each antenna component to be manufactured and prepared independently before final assembly, improving integration efficiency while managing manufacturing complexity through modular construction.
Solution Approach 2:
The interposer serves multiple functions: it provides mechanical support, electrical interconnection between antenna components and electronic components, and spatial positioning for multi-surface mounting. This multi-functional design consolidates several requirements into a single component, simplifying the overall manufacturing process despite the complex multi-surface antenna integration.
Data Source
AI summary
An electronic device is disclosed. The electronic device includes a carrier and a first interposer disposed on the carrier. The first interposer has a first region configured for providing an external electrical connection to outside the electronic device and a second region distinct from the first region. The electronic device also includes a first antenna component disposed on the second region of the first interposer.