Multi Array Electrode ECM for OLED Mask Precision
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Solution Overview
Problem
Current methods for manufacturing fine metal masks (FMMs) for OLED display devices face challenges in achieving accurate micro-scale deposition openings, with etching and electroforming methods often resulting in tolerance issues, over/under etching, and surface irregularities due to high temperature processes.
Innovation Solution
The use of electrochemical machining (ECM) with a multi-array electrode having projecting electrode parts to form fine deposition openings on a thin board, allowing for precise formation of first and second openings that communicate with each other, enabling high-resolution patterns for OLED display devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If etching method is used to manufacture FMM, then deposition openings can be formed on thin board, but tolerance of widths and edges cannot be accurately matched due to enlargement and micro scale pattern
Solution Approach 1:
The patent replaces the mechanical etching process with electrochemical machining (ECM). Instead of using physical etching tools that cause enlargement and tolerance issues, the invention uses electrochemical reactions to precisely remove material and form deposition openings. The ECM process uses controlled electrolysis to dissolve metal at the cathode, enabling accurate pattern transfer without mechanical contact that causes distortion.
Solution Approach 2:
The patent changes the fundamental process parameter from mechanical removal to electrochemical dissolution. By controlling electrical current density, electrolyte composition, and processing time, the ECM process achieves precise control over deposition opening dimensions and edges, eliminating the enlargement problems inherent in traditional etching methods.
2Manufacturing precision
If thin board is etched to manufacture FMM, then deposition openings are formed, but thin board may be over etched or under etched and size of deposition openings may not be uniformly formed
Solution Approach 1:
The patent replaces mechanical etching with electrochemical machining to achieve uniform deposition opening formation. The ECM process uses electrical current distribution to control material removal, ensuring consistent depth and size across all openings. The electrolyte flow and electrical parameters can be precisely controlled to prevent over-etching or under-etching, achieving uniform results that mechanical etching cannot provide.
3Manufacturing precision
If electro forming is used to manufacture FMM, then thin board can be manufactured with deposition openings, but high accuracy may not be available and thin board may be twisted during plating process
Solution Approach 1:
The patent inverts the traditional electroforming approach. Instead of building up metal on a mold and then separating it (which causes twisting), the ECM process directly removes material from the thin board to form deposition openings. This inverse approach eliminates the separation step that causes distortion and maintains the flatness and stability of the thin board throughout the process.
4Manufacturing precision
If laser is used to form deposition openings on thin board, then deposition openings can be formed, but it takes long time and burr may be generated around openings due to high temperature heat source
Solution Approach 1:
The patent replaces thermal laser processing with electrochemical machining. Instead of using high-temperature laser that generates burrs and requires slow scanning, the ECM process uses controlled electrolysis to cleanly remove material. This electrochemical approach produces smooth surfaces without burrs and can process multiple openings simultaneously through array electrodes, dramatically reducing processing time while improving surface quality.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach ensures accurate and precise formation of deposition openings, improving the quality and yield of OLED display devices by reducing tolerance issues and surface irregularities, and enabling the production of high-resolution patterns necessary for ultra-high definition displays.
Implementation Method 1
forming the first openings on one side of a thin board; and forming the second openings on an opposite side of the thin board by electrochemical machining (ECM) using a second multi array electrode
Data Source
AI summary
Provided is a method of manufacturing an organic deposition mask used in manufacturing of an organic light emitting diode (OLED). More specially, provided is a method of manufacturing an organic deposition mask by which fine deposition openings may be formed on a thin board by electrochemical machining (ECM) using a multi array electrode having projecting electrode parts arrayed thereon. According to an embodiment of the present invention, the method of manufacturing an organic deposition mask including deposition openings formed of first openings facing a deposition source and second openings facing a deposited object, the method may include: forming the first openings on one side of a thin board; and forming the second openings on an opposite side of the thin board by electrochemical machining (ECM) using a second multi array electrode having second projecting electrode parts arrayed thereon so as to communicate with the first openings.