Multi-Axial Acceleration Sensor Chip Orientation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional tri-axial acceleration sensors face complexities in manufacturing due to heat dissipation and signal interference issues, requiring a more efficient method for multi-axial acceleration detection.
Innovation Solution
A manufacturing method involving a substrate with a lead plane, where the first acceleration sensor chip is disposed with a perpendicular wire bonding plane and the second acceleration sensor chip is disposed with a parallel wire bonding plane, allowing for distinct axis sensing without dense packaging.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If a conventional tri-axial acceleration sensor integrates acceleration detection mechanism and integrated circuits on a single chip to sense along three different axes, then multi-axial acceleration detection capability is achieved, but manufacturing process complexity increases and heat dissipation problems occur
Solution Approach 1:
The patent divides the acceleration sensor system into separate functional modules: individual acceleration sensor chips for different axes are disposed on the package substrate at different orientations (e.g., first chip for Z-axis, second chip for X-axis, third chip for Y-axis). This segmentation allows each chip to be optimized independently and simplifies the manufacturing process while maintaining multi-axial detection capability.
2Adaptability or versatility
If a conventional tri-axial acceleration sensor integrates acceleration detection mechanism and integrated circuits on a single chip, then multi-axial acceleration detection capability is achieved, but signal interference between different axes occurs
Solution Approach 1:
By separating the acceleration detection mechanisms for different axes into distinct sensor chips, the patent eliminates signal interference between axes. Each chip independently detects acceleration along its specific axis and transmits signals through separate wire bonding connections, ensuring signal isolation and improved measurement accuracy.
3Area of stationary object
If acceleration sensor chips are densely packaged to achieve compact multi-axial sensing, then device size is reduced, but heat dissipation becomes problematic
Solution Approach 1:
The patent utilizes spatial orientation in three-dimensional space by disposing sensor chips at different angles and positions on the package substrate. Instead of dense planar packaging, chips are arranged with specific orientations (e.g., perpendicular and parallel arrangements relative to the substrate plane), which distributes heat sources more effectively and improves thermal dissipation while maintaining compact form factor.
Data Source
AI summary
The present invention provides a multi-axial acceleration sensor and a method of manufacturing the multi-axial acceleration sensor. The method includes: providing a substrate having a lead plane; disposing a first sensor chip onto the lead plane, wherein a wire bonding plane of the first sensor chip is perpendicular to the lead plane; and disposing a second sensor chip onto the lead plane, wherein a wire bonding plane of the second sensor chip is in parallel with the lead plane.