Multi-Axis Force Sensor Chip Layout for Precise Stress Measurement
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Solution Overview
Problem
Existing force sensors are large and require multiple transducers for multi-axial stress measurement, leading to poor spatial resolution and erroneous results, especially in rigid systems, and semiconductor strain gauges are mechanically sensitive and prone to breakage.
Innovation Solution
A compact device with a spring body and sensor chip, where the sensor chip is mounted on the base plate below the force transmitter, allowing for precise, spatially resolved measurement of deformations, stresses, and torques by concentrating multi-axial loads in a localized area, using a single sensor chip with multiple sensor elements on a semiconductor substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If multiple sensor transducers are used for multi-axial stress measurement, then measurement capability is improved, but device size increases and spatial resolution deteriorates
Solution Approach 1:
Multiple sensor transducers are integrated onto a single semiconductor chip, allowing multi-axial stress measurement while maintaining compact dimensions. The chip combines several measurement functions in one small component, resolving the contradiction between measurement capability and device size.
Solution Approach 2:
The patent transitions from discrete, spatially distributed transducers to a planar integration of multiple sensors on a chip surface. This dimensional reorganization allows multiple measurement points to coexist in a compact area, improving spatial resolution while maintaining multi-axial measurement capability.
2Ease of manufacture
If large-area transducers are used, then manufacturing is simplified, but spatial resolution of local stress states deteriorates
Solution Approach 1:
The transducer function is segmented into multiple small sensor elements on a semiconductor chip rather than using a single large-area transducer. This segmentation enables high spatial resolution while leveraging standard semiconductor manufacturing processes for ease of production.
Solution Approach 2:
The patent changes the characteristic dimension parameter from large-area to micro-scale dimensions, enabling both high spatial resolution and compatibility with standard semiconductor manufacturing techniques that excel at producing small, precise structures.
3Measurement precision
If semiconductor strain gauges are used, then spatial resolution is improved, but mechanical reliability deteriorates due to breakage susceptibility
Solution Approach 1:
Multiple fragile semiconductor strain gauges are combined into a single integrated chip structure, providing mutual mechanical support and reducing overall susceptibility to breakage while maintaining high spatial resolution through the array of sensor elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables high-precision, robust measurement of multi-axial stresses with a compact design, suitable for sensitive applications like robotics and 3D coordinate metrology, and reduces mechanical sensitivity issues.
Implementation Method 1
one or more sensor elements for measuring deformations, stresses, forces and/or torques
Data Source
Figure 1A~1B
Figure 2A~2B
Figure 3A~3C
AI summary
The invention preferably relates to a device for measuring deformations, stresses, forces and/or torques of an object, comprising a spring body and a sensor chip which comprises one or more sensor elements for measuring a deformation, stress, force and/or a torque and an electronic circuit on a substrate. The spring body comprises a base plate, on the front side of which a force transmitter, preferably in the form of a pin, is installed, wherein the sensor chip is positioned on the rear side of the base plate below the force transmitter. The invention furthermore relates to a system comprising a described device and a data processing unit, wherein the data processing unit is configured to read out measurement data ascertained by the sensor chip and preferably ascertains the forces and/or torques acting on the force transmitter on the basis of said measurement data.