Multi-Axis Mounting Structure for Thermal Expansion in Tight Clearances

The mounting device is divided into multiple pins (first pin along first axis, second pin along second axis) that can move independently. Each pin is constrained by its own bearing assembly, allowing segmented movement that accommodates thermal expansion while distributing stress across multiple independent elements rather than concentrating it in a single link structure.

The invention transitions from a single-link mounting device to a multi-pin structure with pins extending along different axes (first axis and second axis). This dimensional change allows the mounting device to accommodate thermal expansion in multiple directions simultaneously, converting a one-dimensional thermal compensation problem into a multi-dimensional solution that reduces stress through distributed movement.

The mounting device is segmented into multiple independent pin elements rather than a single link structure. This segmentation allows each pin to be compact and fit within small clearance spaces while collectively providing the necessary mounting functionality. The first pin and second pin can be positioned independently to accommodate tight spatial constraints.

Spherical bearings are used to constrain the pins, providing smooth rotational movement in multiple directions. The spherical geometry allows compact design while enabling the pins to accommodate thermal expansion and contraction through rotational movement, fitting within small clearances without requiring complex articulated link mechanisms.

Instead of using a single short link that rocks, the invention segments the mounting function into multiple pins constrained by spherical bearings. Each pin moves independently in its own bearing assembly, eliminating the rocking motion that occurs in single-link devices. The segmentation distributes the thermal expansion movement across multiple independent elements rather than forcing a single link to rock.

The invention adds dimensional independence by having pins extend along different axes (first axis and second axis) with spherical bearings allowing movement in multiple directions. This multi-dimensional constraint system prevents the rocking motion inherent in single-link devices by providing independent movement paths for each pin, accommodating thermal expansion without inducing stress through rocking.