Multi-Axis Positioning Paths for Heat-Sensitive Measurement Accuracy
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Solution Overview
Problem
Semiconductor device manufacturing is challenged by the impact of heat and other conditions on measurement devices, leading to navigational alignment errors and measurement errors due to heat flux from motors moving along certain axes.
Innovation Solution
A system and method that calculates and selects candidate paths for apparatus movement, minimizing movement along axes affected by heat flux, such as the Y axis, to reduce navigational and measurement errors by using a path manager and controller to optimize movement along multiple axes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the apparatus moves along axes with high motor heat flux (such as Y axis), then positioning speed and productivity are improved, but navigational alignment errors and measurement errors increase due to heat flux impact
Solution Approach 1:
The system dynamically adjusts movement parameters based on real-time temperature feedback. The controller modifies acceleration, deceleration, and positioning speeds along affected axes to optimize the balance between productivity and measurement precision, preventing thermal errors while maintaining efficient operation.
Solution Approach 2:
The system changes operational parameters such as movement speed, acceleration, and positioning rates based on temperature conditions. By adjusting these parameters dynamically, the system maintains measurement accuracy while preserving productivity despite heat flux constraints.
2Speed
If the apparatus moves along axes with high motor heat flux, then positioning speed is improved, but measurement errors increase due to thermal expansion and refractive index changes
Solution Approach 1:
Temperature sensors provide continuous feedback on motor and carriage temperatures. The controller uses this feedback to adjust movement parameters in real-time, compensating for thermal effects on measurement accuracy while maintaining high positioning speeds.
Solution Approach 2:
The system dynamically adapts movement characteristics based on thermal conditions, adjusting speeds and accelerations to prevent thermal-induced measurement errors while preserving productivity.
3Productivity
If the apparatus uses high acceleration for rapid positioning, then productivity is improved, but heat flux from motors increases causing navigational alignment errors
Solution Approach 1:
The system dynamically adjusts acceleration profiles based on real-time temperature feedback. By modulating acceleration levels, the system maintains high productivity while preventing excessive heat flux that would cause navigational alignment errors.
Solution Approach 2:
The system implements periodic cooling intervals and alternating movement patterns to distribute thermal load. This allows rapid positioning while preventing concentrated heat buildup that would compromise measurement accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Reduces navigational alignment errors and measurement errors by optimizing movement paths, ensuring accurate positioning and measurement of semiconductor devices.
Implementation Method 1
heat flux from one of the plurality of motors that moves the apparatus along the at least one selected axis negatively impacts operation of the apparatus
Data Source
AI summary
Positioning apparatus by determining multiple candidate paths for positioning the apparatus at multiple locations, where the positioning requires moving the apparatus in a sequence of movements along multiple axes, selecting a shortest one of the candidate paths requiring a total amount of movement of the apparatus along a selected one of the axes that is less than a total amount of movement of the apparatus required along a specified other of the axes, and causing the apparatus to traverse the selected path.