Multi-band Millimeter Wave Patch Antennas with Parasitic Isolation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic devices face challenges in supporting high-frequency wireless communications above 10 GHz due to signal attenuation and space constraints, particularly in millimeter wave and centimeter wave bands.
Innovation Solution
The implementation of co-located patch antennas with a parasitic antenna resonating element in a phased antenna array configuration, which allows for efficient coverage of both centimeter and millimeter wave frequency bands within a compact space, using a dielectric substrate with multiple layers and cross-shaped parasitic elements to enhance isolation and bandwidth.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If separate antennas are used for centimeter wave and millimeter wave frequency bands, then each antenna can be optimized for its specific frequency band, but the overall device occupies excessive space
Solution Approach 1:
The patent combines centimeter wave and millimeter wave patch antennas into a single integrated antenna structure. The centimeter wave patch antenna and millimeter wave patch antenna are positioned adjacent to each other on the same substrate, sharing common feed structures and ground planes. This merging allows both frequency bands to be covered within a compact area, resolving the contradiction between frequency band adaptability and device area.
Solution Approach 2:
The integrated antenna structure serves multiple functions simultaneously - it operates as both a centimeter wave antenna and a millimeter wave antenna. The shared feed network and ground plane structures provide universal support for both frequency bands, enabling a single antenna system to perform what traditionally required separate antenna systems.
2Area of stationary object
If antenna elements are placed close together to reduce space, then space requirements are minimized, but isolation between antenna elements deteriorates
Solution Approach 1:
The patent introduces localized ground plane structures and feed network configurations between the centimeter wave and millimeter wave patch antennas. These local modifications create electromagnetic isolation zones that prevent coupling between the closely-spaced antenna elements. The ground plane extensions and feed line arrangements are specifically designed to maintain isolation despite the reduced distance between antenna elements.
3Ease of manufacture
If a simple patch antenna structure is used, then manufacturing is simplified, but bandwidth and efficiency at millimeter wave frequencies are insufficient
Solution Approach 1:
The patent employs a composite antenna structure that combines traditional patch antenna elements with additional parasitic elements and specific ground plane configurations. This composite structure enhances the millimeter wave performance by creating multiple resonance modes and improving radiation efficiency, while still maintaining compatibility with standard PCB manufacturing processes. The integrated design uses conventional materials and fabrication techniques to achieve improved millimeter wave characteristics.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables effective communication across multiple frequency bands from 27.5 GHz to 71 GHz, minimizing space requirements and improving antenna efficiency, thereby addressing the challenges of signal attenuation and space constraints in high-frequency wireless communications.
Implementation Method 1
The first patch antenna may include a first patch antenna resonating element formed from metal traces on a second dielectric layer. The second patch antenna may include a second patch antenna resonating element over the first patch antenna resonating element.
Implementation Method 2
A cross-shaped parasitic antenna resonating element may be formed over the second patch antenna resonating element and on a fourth dielectric layer.
Implementation Method 3
The dielectric substrate may include multiple dielectric layers. A ground plane may be formed on a first dielectric layer.
Data Source
AI summary
An electronic device may be provided with wireless circuitry including first and second patch antennas. The first patch antenna may include a first resonating element formed over a ground plane. The second patch antenna may include a second resonating element over the first resonating element. A cross-shaped parasitic element may be formed over the second resonating element. First and second feed terminals may be coupled to the second resonating element. An opening may be formed in the first resonating element. First and second transmission lines may be coupled to the first and second feed terminals through the opening. The cross-shaped parasitic element may include arms that overlap the first and second feed terminals. The first resonating element may cover first frequencies between 10 GHz and 300 GHz and the second resonating element may cover second frequencies that are higher than the first frequencies.