Multi-Bandwidth Balun Using Shared Inductor and Stacked Layers
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Solution Overview
Problem
Existing multi-bandwidth baluns require multiple inductors and complex electrical matching networks, leading to increased material costs, larger semiconductor component size, and difficulty in miniaturization due to the need for multiple unbalanced signal transmission ports.
Innovation Solution
A multi-bandwidth balun design utilizing mutual inductance between inductors, where a single main inductor induces multiple conversion circuits, and passive elements like capacitors are distributed across different circuit layers, reducing the number of inductors and the area required on the semiconductor base layer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If two sets of electrical matching networks are designed for multi-bandwidth operation, then the balun can operate across multiple frequency bands, but the number of semiconductor components increases and manufacturing cost rises
Solution Approach 1:
The patent merges two separate main inductors into a single shared main inductor that serves both frequency bands. The first and second inductors are both inducted with this single main inductor to form respective conversion circuits, eliminating the need for two separate main inductors and reducing component count while maintaining multi-bandwidth functionality
Solution Approach 2:
The single main inductor performs multiple functions by being inducted with both the first inductor (for first bandwidth operation) and the second inductor (for second bandwidth operation). This universal component enables the balun to operate across multiple frequency bands without requiring separate matching networks for each band
2Adaptability or versatility
If two main signal ports are formed on the same surface of the base layer, then the balun can provide unbalanced signal transmission for both bands, but the circuit arrangement area increases and miniaturization becomes difficult
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked architecture by placing the first and second inductors on different circuit layers. The first inductor is on a first circuit layer while the second inductor is on a second circuit layer, with conductive vias providing vertical electrical connections. This vertical stacking reduces the horizontal footprint and enables miniaturization while maintaining both unbalanced signal transmission capabilities
3Ease of manufacture
If all circuit elements are formed on the same surface of the base layer, then the manufacturing process is simplified, but the semiconductor component size increases and cannot be minimized
Solution Approach 1:
The patent employs multi-layer circuit construction where the first inductor, first capacitor module, and related components are formed on a first circuit layer, while the second inductor, second capacitor module, and related components are formed on a second circuit layer. Conductive vias provide vertical interconnections between layers, enabling three-dimensional integration that reduces the horizontal footprint and enables component miniaturization
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the number of semiconductor components, lowers manufacturing costs, and achieves miniaturization by using mutual inductance and multi-layer stacking of passive devices, effectively converting signals across multiple frequency bands with minimal area and volume requirements.
Implementation Method 1
a first inductor inducted mutually with the main inductor to constitute a first conversion circuit, a second inductor inducted mutually with the main inductor to constitute a second conversion circuit
Data Source
AI summary
A multi bandwidth balun is provided, including a main signal port, a main inductor electrically connected to the main signal port, a first inductor inducted mutually with the main inductor to constitute a first inductor of a first conversion circuit, a first capacitor module connected in parallel to the first conversion circuit, two first signal ports electrically connected to the first capacitor module, a first main capacitor electrically connected to the first signal port and the first capacitor module therebetween, a second inductor inducted mutually with the main inductor to constitute a second inductor of a second conversion circuit, a second capacitor module connected in parallel to the second conversion circuit, two second signal ports electrically connected to the second capacitor module, and a second main capacitor electrically connected to the second signal port and the second capacitor module therebetween.