Charged-particle Multi-beam Column with Aperture and Collimator Arrays
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Solution Overview
Problem
Current charged-particle multi-beam tools face challenges in reducing complexity and improving throughput during semiconductor IC chip manufacturing, particularly in detecting and identifying micro and nano-scale defects on substrates, which affects yield and throughput.
Innovation Solution
A charged-particle multi-beam column design featuring a sub-beam defining aperture array, collimator array, objective lens array, and detector configuration that allows for the projection of multiple sub-beams onto a sample with focused corrections, enabling efficient defect detection and improved processing efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a traditional charged-particle multi-beam tool design is used, then the system can perform defect detection, but the device complexity and alignment correction requirements increase
Solution Approach 1:
The beam path is segmented into distinct functional zones: a first region with a first magnetic field for initial beam formation and a second region with a second magnetic field for final beam projection. This segmentation allows each region to be optimized independently, reducing overall system complexity while maintaining detection precision.
Solution Approach 2:
A charge exchange gas is introduced as an intermediary medium in the beam path. The gas enables charge exchange between electrons and ions, allowing the beam charge state to be modified without complex electromagnetic lenses or deflectors, thereby simplifying the beam path while maintaining control over beam properties for precise defect detection.
2Manufacturing precision
If complex alignment and correction systems are implemented, then beam projection accuracy improves, but throughput and processing efficiency decrease
Solution Approach 1:
The charge exchange gas system provides self-aligning properties where the beam automatically adjusts to optimal charge states through interaction with the gas medium. This eliminates the need for complex active alignment systems and correction mechanisms, maintaining high beam projection accuracy while enabling continuous operation at high throughput without frequent recalibration.
3Measurement precision
If multiple beam correction systems are added, then detection accuracy improves, but the inspection process time increases
Solution Approach 1:
The system changes the charge state parameter of the beam through charge exchange with the introduced gas, rather than using multiple correction systems. This single parameter change (charge state) achieves the necessary beam control for accurate defect detection, eliminating time-consuming iterative correction processes and enabling faster inspection while maintaining high detection accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances the detection and identification of defects, improving the yield and throughput of semiconductor IC chip manufacturing by simplifying the beam path and reducing the need for complex alignment and correction systems, thereby increasing the efficiency of the inspection process.
Implementation Method 1
a sub-beam defining aperture array configured to form sub-beams from a beam of charged particles emitted by a source
Implementation Method 2
a collimator array down-beam from the sub-beam defining aperture array, each collimator being configured to collimate a sub-beam
Implementation Method 3
an objective lens array, each objective lens being configured to project a collimated sub-beam onto a sample
Implementation Method 4
a detector configured to detect charged particles emitted from the sample
Implementation Method 5
The interactions between the material structure at the probing spot and the landing electrons from the beam of electrons cause electrons to be emitted from the surface, such as secondary electrons
Data Source
AI summary
The disclosure relates to charged-particle multi-beam columns and multi-beam column arrays. In one arrangement, a sub-beam defining aperture array forms sub-beams from a beam of charged particles. A collimator array collimates the sub-beams An objective lens array projects the collimated sub-beams onto a sample. A detector detects charged particles emitted from the sample. Each collimator is directly adjacent to one of the objective lenses. The detector is provided in a plane down-beam from the sub-beam defining aperture array.