Multi-beam Deflector Array with Depression-Embedded Electrodes
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Solution Overview
Problem
Existing particle-beam exposure apparatuses face challenges in shielding blanking apertures against cross-talking, complex electrode formation, sensitivity to deformation and stress, and limitations in electric field strength due to electrode height, which complicates the production and alignment of pattern definition devices.
Innovation Solution
A multi-beam deflector array device with a membrane region having apertures and electrodes positioned within depressions, reducing cross-talk and allowing for a single plate configuration that integrates beam forming and deflection functions, using thermally conductive materials and semiconducting substrates like silicon for improved thermal management and electrostatic field control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If electrodes are formed by perpendicular growth using electroplating techniques, then shielding of blanking apertures against cross-talking is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The harmful effect of cross-talking is eliminated by removing the need for complex perpendicular growth electrodes. Instead, simple planar electrodes are used combined with a ground plane structure that inherently shields the apertures without requiring three-dimensional electrode formation.
Solution Approach 2:
The complex electroplating process for forming perpendicular electrodes is replaced by a simpler planar electrode design with ground plane shielding. This substitutes a mechanically complex electrode formation system with a simpler planar structure that achieves the same shielding function.
2Object-affected harmful factors
If electrodes are formed by perpendicular growth, then shielding against cross-talking is improved, but manufacturing cost and process complexity increase
Solution Approach 1:
The complex perpendicular growth electrode formation process is extracted and removed from the manufacturing system. The shielding function is achieved instead through planar electrodes with ground plane structures that are much easier to manufacture using standard fabrication techniques.
Solution Approach 2:
The expensive and complex perpendicular growth electrode structure is replaced with simpler, cheaper planar electrodes. The ground plane structure provides the necessary shielding at lower manufacturing cost without requiring sophisticated electroplating processes.
3Object-affected harmful factors
If electrodes have substantial height over the blanking plate, then shielding is improved, but electric field strength tolerance is reduced due to stray fields
Solution Approach 1:
The shielding function of tall perpendicular electrodes is copied and achieved through a planar ground plane structure. This two-dimensional ground plane replicates the electromagnetic shielding effect without the harmful stray fields that arise from three-dimensional electrode structures.
Solution Approach 2:
The three-dimensional electrode structure that creates stray fields is replaced by a planar ground plane system. This substitution eliminates the electric field distortion problems while maintaining the shielding function against cross-talking.
4Adaptability or versatility
If multiple separate plates are used for aperture array and deflector array, then functional separation is achieved, but alignment accuracy and system complexity increase
Solution Approach 1:
The aperture array and deflector array are merged into a single integrated plate structure. The ground plane and electrodes are formed on the same substrate as the apertures, eliminating alignment issues between separate plates while maintaining all necessary functions.
Solution Approach 2:
A single plate structure performs multiple functions: it provides the aperture array for beam formation, the ground plane for shielding, and the electrodes for beam deflection. This multi-functional design eliminates the need for multiple separate components and their associated alignment requirements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution minimizes cross-talk, reduces the size and cost of the pattern definition system, enhances thermal conduction, and maintains electrostatic field integrity, enabling efficient and accurate beam deflection without significant stray fields, thus improving the overall performance and reliability of the particle-beam exposure apparatus.
Implementation Method 1
an array of electrodes, wherein each aperture is associated with at least one of said electrodes... The electrodes are configured to realize a non-deflecting state, wherein the particles that pass through the apertures are allowed to travel along a desired path, and a deflecting state, wherein the particles are deflected off the desired path
Implementation Method 2
using thermally conductive materials and semiconducting substrates like silicon for improved thermal management
Data Source
AI summary
The invention relates to a multi-beam deflector array device for use in a particle-beam exposure apparatus employing a beam of charged particles, the multi-beam deflector array device having a plate-like shape with a membrane region, the membrane region including a first side facing towards the incoming beam of particles, an array of apertures, each aperture allowing passage of a corresponding beamlet formed out of the beam of particles, a plurality of depressions, each depression being associated with at least one aperture, and an array of electrodes, each aperture being associated with at least one electrode and each electrode being located in a depression, the electrodes being configured to realize a non-deflecting state, wherein the particles that pass through the apertures are allowed to travel along a desired path, and a deflecting state, wherein the particles are deflected off the desired path.