Multi-Beam Writing Sequence for Beam Distortion Averaging
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Solution Overview
Problem
Existing multiple beam writing techniques suffer from position deviation due to beam array distortion, which affects pattern accuracy and dimension precision in semiconductor manufacturing, and existing methods to mitigate this issue are insufficient.
Innovation Solution
A method involving setting groups of beam irradiation units in a mesh pattern on the substrate, with a unique writing order for each group based on a processing number, and performing multiple writing in accordance with this order to reduce position deviation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the number of passes is increased to perform multiple writing in the same stripe region, then the averaging effect is enhanced, but the distortion of beam array shape cannot be sufficiently reduced
Solution Approach 1:
The patent dynamically changes the writing direction in alternate passes (normal direction in odd passes, reverse direction in even passes). This dynamic adjustment ensures that the beam array distortion affects different positions in different passes, and the averaging effect combines these varied measurements to reduce the overall distortion impact, achieving better beam array shape accuracy.
Solution Approach 2:
The patent implements periodic alternation between normal and reverse writing directions across multiple passes. This periodic action creates a systematic pattern where distortion effects are distributed and averaged over time, enhancing the reliability of the measurement and reducing the impact of beam array shape distortion on final precision.
2Ease of manufacture
If the same position is written repeatedly by the same beam in multiple writing, then the process is simple, but the influence due to beam array shape distortion is not sufficiently reduced
Solution Approach 1:
The patent introduces reverse direction writing in even-numbered passes, which complicates the process slightly but ensures that different beams write to the same positions across passes. This inversion strategy systematically eliminates position deviations caused by beam array distortion while maintaining reasonable process complexity through automated direction control.
Solution Approach 2:
The patent dynamically adjusts the writing direction based on pass number, creating a controlled variation in the writing process. This dynamic approach maintains ease of manufacture through automated control while effectively reducing position deviation by ensuring each position is written by multiple different beams across passes with varying directions.
Data Source
AI summary
A multiple charged particle beam writing method includes setting a plurality of groups each composed of a plurality of beam irradiation unit regions located in each of a plurality of pitch cell regions being a mesh shape obtained by dividing a writing region of a substrate by a beam pitch size between beams of multiple charged particle beams on the substrate, setting the writing order of each of the plurality of groups each designated by each processing number indicating a processing order of multiple writing processing such that the writing order of each of the plurality of groups is different from each other depending on each processing number, and performing multiple writing in accordance with a set writing order of each of the plurality of groups each designated by each processing number in the multiple writing processing.