Multi-Beam Laser Scanning Layout for Fewer Wafer Grooving Passes
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Solution Overview
Problem
Existing laser grooving processes are limited by the number of scans required, which affects productivity in dicing wafers or etching patterns.
Innovation Solution
A laser processing apparatus and method that utilizes a stage, laser light source, beam dividers, and condensing lenses to generate and scan multiple laser branch beams along parallel scan lines, allowing simultaneous scanning and adjustment of beam spacing to improve productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple laser beams are used to increase productivity, then the number of scans is reduced, but the optical system size increases
Solution Approach 1:
The patent combines multiple laser beams (first and second laser beams) into a single optical system that shares common components including the condensing lens, scanning mirrors, and beam delivery path. This merging approach enables simultaneous processing along multiple scan lines while minimizing the increase in overall optical system size by reusing optical components across different beam paths.
Solution Approach 2:
The patent segments the laser beam into multiple separate beams (first laser beam and second laser beam) that can be independently controlled and directed along different scan lines. This segmentation allows parallel processing operations to increase productivity while the beams are subsequently recombined into a unified optical system for efficient space utilization.
2Speed
If multiple laser beams are scanned simultaneously, then processing speed increases, but beam spacing control becomes more difficult
Solution Approach 1:
The patent incorporates feedback mechanisms through scanning control units that monitor and adjust the positions of multiple laser beams in real-time during simultaneous scanning. This feedback system ensures precise beam spacing control by detecting positional deviations and making corrective adjustments to maintain optimal spacing between the first and second laser beams along their respective scan lines.
Solution Approach 2:
The patent employs dynamic control of beam spacing through adjustable optical elements and scanning parameters that can be modified in real-time during operation. The beam spacing is not fixed but can be dynamically adjusted based on processing requirements, enabling easy operation while maintaining high processing speed through simultaneous multi-beam scanning.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances productivity by enabling simultaneous scanning of multiple laser branch beams along adjacent scan lines with minimal optical system size increase, allowing real-time tracking of surface height and easy adjustment of beam spacing.
Implementation Method 1
a polarization filter configured to polarize the cylindrical vector beam to form a double-o shaped beam in which a first laser beam and a second laser beam are arranged adjacent to each other
Implementation Method 2
a diffractive optical element configured to divide the first laser beam into a plurality of first laser sub-beams in the second horizontal direction and to divide the second laser beam into a plurality of second laser sub-beams in the second horizontal direction
Implementation Method 3
a condensing lens in optical paths of the plurality of first laser sub-beams and the plurality of second laser sub-beams, the condensing lens being configured to condense the plurality of first laser sub-beams into the plurality of first laser branch beams and condense the plurality of second laser sub-beams into the plurality second laser branch beams on the substrate
Implementation Method 4
a laser light source configured to generate a source laser beam; a mode converter configured to convert the source laser beam into a cylindrical vector beam
Data Source
AI summary
A laser processing apparatus includes a stage to support a substrate, a laser light source to generate a source laser beam, a first beam divider to divide the source laser beam into first and second laser beams in a first horizontal direction, a second beam divider to divide the first laser beams into a plurality of first laser sub-beams in a second horizontal direction and to divide the second laser beam into a plurality of second laser sub-beams in the second horizontal direction, and a condensing lens to condense the plurality of first laser sub-beams into a plurality of first laser branch beams that are spaced apart along a first scan line on the substrate and to condense the plurality of second laser sub-beams into a plurality of second laser branch beams spaced apart along a second scan line parallel with the first scan line on the substrate.