Multi-Beam Laser Reflow Control for Uniform Large-Area Soldering
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Solution Overview
Problem
Conventional laser reflow processes face challenges in large-area processing due to high-output laser requirements, beam flatness issues, and temperature deviations, leading to soldering defects and increased costs, which conventional mass reflow processes cannot effectively address.
Innovation Solution
A laser reflow apparatus and method using a multi-beam, multi-optic system with symmetrical low-output laser modules and a camera unit for precise control, enabling flat superposition of laser beams to maintain temperature stability and reduce energy consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If conventional mass reflow process is used for ultra-thin semiconductor chips, then large-area processing is achieved, but temperature deviation and thermal shock cause soldering defects
Solution Approach 1:
The patent divides the processing system into multiple independent laser modules (e.g., 4 modules arranged in 2x2 configuration) that can be independently controlled. Each module processes a specific region, allowing precise temperature control for ultra-thin chips while covering large substrate areas, thereby preventing soldering defects caused by thermal shock.
2Productivity
If high-output laser is used for large-area laser reflow, then processing speed is improved, but beam flatness deteriorates and temperature deviation increases
Solution Approach 1:
Instead of using a single high-output laser, the patent segments the laser system into multiple low-output modules. Each module operates at lower power with better beam flatness, and their combined output achieves the required processing speed for large areas while maintaining temperature uniformity within 3-4°C.
Solution Approach 2:
The patent merges multiple low-output laser beams into a coordinated processing system. By synchronizing multiple modules with individual control, the system achieves both high productivity (through parallel processing) and high temperature uniformity (through independent power adjustment of each module).
3Device complexity
If conventional laser reflow with single module is used, then device complexity is reduced, but power consumption increases and beam flatness cannot be maintained
Solution Approach 1:
The patent segments the laser system into multiple low-power modules instead of using one high-power module. This segmentation reduces the power consumption of each individual component while collectively achieving the required processing output, and also improves beam flatness through the distributed architecture.
4Object-affected harmful factors
If laser reflow is used for ultra-thin chips, then thermal shock is reduced, but temperature control precision must be maintained within 3-4°C
Solution Approach 1:
The patent incorporates feedback control mechanisms where each laser module's power output is independently adjusted based on real-time monitoring. This feedback system maintains temperature control precision within 3-4°C across the entire substrate, preventing thermal shock to ultra-thin chips while ensuring uniform heating.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Prevents soldering defects, reduces device damage, and lowers costs by maintaining temperature deviation below 3 to 4°C, effectively substituting conventional mass reflow processes in large-area substrate processing.
Implementation Method 1
a laser emission unit comprised of a plurality of laser modules for emitting a laser beam
Implementation Method 2
a camera unit comprising at least one camera module for capturing a reflowing process of the electronic components
Data Source
AI summary
Provided is a laser reflow apparatus for reflowing electronic components on a substrate disposed on a stage, the apparatus including: a laser emission unit comprised of a plurality of laser modules for emitting a laser beam having a flat top output profile in at least one section of the substrate on which the electronic components are disposed; a camera unit comprising at least one camera module for capturing a reflowing process of the electronic components performed by the laser beam; and a laser output control unit configured to generate a control signal for independently controlling the respective laser modules of the laser emission unit based on a signal output from the camera unit and apply the control signal to the laser emission unit.