Multi-Beam Laser Thickness Control for Surface Structure Formation
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Solution Overview
Problem
Existing processing apparatuses struggle to efficiently form or remove structures on object surfaces by irradiating them with laser beams, as they often fail to accurately control the relative positional relationships, intensity distributions, and intercrossing angles of processing lights, leading to inadequate thickness changes or removal of material.
Innovation Solution
A processing apparatus that utilizes a light irradiation system to adjust the relative positional relationships, intensity distributions, and intercrossing angles of multiple processing lights, including laser beams, to precisely control the thickness or removal of parts on an object's surface by intersecting them with the surface at specific angles and depths of focus.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If a single laser beam is used to process the object surface, then the apparatus structure is simple, but the manufacturing precision and control over thickness changes are insufficient
Solution Approach 1:
The patent divides a single laser beam into multiple processing lights using a beam splitter or diffractive optical element. Each processing light can be independently focused and controlled to irradiate different regions of the object surface, enabling precise thickness control through coordinated irradiation patterns while using relatively simple optical components
Solution Approach 2:
The patent combines multiple processing lights into a unified irradiation system that works together to achieve the desired thickness changes. By merging the effects of multiple lights with different intensity distributions and focal positions, the system achieves superior manufacturing precision without requiring excessively complex individual components
2Manufacturing precision
If multiple processing lights are used to control thickness changes, then the manufacturing precision is improved, but the device complexity increases
Solution Approach 1:
The patent employs dynamic control of the multiple processing lights by adjusting their intensity distributions, focal positions, and irradiation patterns in real-time based on the desired structure geometry. This dynamic adjustment capability allows precise structure formation while keeping the optical system configuration relatively fixed, reducing overall device complexity
Solution Approach 2:
The patent achieves precise structure formation by changing parameters of the processing lights such as intensity distribution, wavelength, and focal depth rather than adding complex optical components. By controlling these parameters dynamically, the system achieves high manufacturing precision with a manageable optical system
3Productivity
If the processing lights are focused at a single depth, then the optical system is simple, but the productivity is reduced due to multiple irradiation passes
Solution Approach 1:
The patent extends the processing capability from single-depth irradiation to multi-depth simultaneous irradiation by introducing axial focus control. Multiple processing lights can be focused at different depths along the optical axis, enabling volumetric material removal or modification in a single pass, thereby significantly improving productivity without requiring multiple sequential irradiation passes
Solution Approach 2:
The patent pre-configures the intensity distributions and focal positions of multiple processing lights to match the desired three-dimensional structure geometry before irradiation begins. This preliminary setup allows the system to achieve complex thickness variations and structure formation in a single irradiation pass, enhancing productivity while maintaining manageable focus control system complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus achieves precise control over thickness changes or removal of material on object surfaces, enabling efficient formation of structures such as riblet structures, reducing surface resistance, and improving throughput and accuracy in processing operations.
Implementation Method 1
a light irradiation apparatus that irradiates a surface of an object with a plurality of processing lights
Implementation Method 2
the processing apparatus removes a part of the object by irradiating the surface of the object with the processing lights
Data Source
AI summary
A processing apparatus has: a light irradiation apparatus that irradiates a surface of an object with a plurality of processing lights; and a first change apparatus that changes a relative positional relationship between light concentration positions of the plurality of processing lights in a direction that intersects with the surface of the object, the processing apparatus changes a thickness of a part of the object by irradiating the surface of the object with the plurality of processing lights.