Multi-beam Phased-Array Antenna Integration
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Solution Overview
Problem
The existing multi-beam phased-array antenna systems face challenges in achieving low-cost implementation and simplified digital signal control and synchronization due to complex interconnection requirements and high costs associated with miniature high-frequency connectors, especially in mmWave frequency spectrum applications where space is limited.
Innovation Solution
A multi-beam phased-array antenna design that integrates the signal combiner/divider and distribution network within the antenna substrate, using interposer substrates and beamforming processing units (BPU ICs) to eliminate the need for miniature connectors, allowing for reduced coupling and cost-effective assembly, and incorporates a serial bus control system with redundancy for harsh environments.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional phased array antenna structure with separate transceiver modules and signal combiner/divider network is used, then high performance is achieved, but high cost and complicated manufacturing and assembly result
Solution Approach 1:
The patent combines the signal combiner/divider network with the antenna aperture plate into a single integrated structure. The combiner/divider network is fabricated directly on the aperture plate substrate, eliminating the need for separate transceiver modules and their connections via miniature connectors. This integration reduces the number of components and interconnections, thereby simplifying manufacturing and assembly while maintaining signal performance.
Solution Approach 2:
The aperture plate substrate serves multiple functions: it provides the mechanical support structure for the antenna elements, acts as the substrate for the signal combiner/divider network, and provides the interconnection pathways for signal distribution. This multi-functionality reduces the overall system complexity and component count.
2Reliability
If miniature high frequency connectors are used to connect transceiver modules to antenna elements in mmWave phased-array antenna, then signal transmission is maintained, but cost and device complexity increase
Solution Approach 1:
The patent eliminates miniature connectors by integrating the signal distribution network directly into the aperture plate substrate. Transceiver modules are connected to the antenna elements through traces fabricated on the substrate rather than through physical connectors, thereby reducing device complexity and cost while maintaining signal transmission integrity.
Solution Approach 2:
The patent replaces the mechanical connector system with an integrated printed circuit board trace system. Instead of using physical miniature connectors to make electrical connections, the signal pathways are created through conductive traces fabricated directly on the aperture plate substrate, eliminating the need for mechanical assembly of connectors.
3Area of moving object
If antenna elements are placed close to each other in mmWave phased-array antenna, then large number of miniaturized antennas can be placed in small area, but little room is available for signal and control interconnection
Solution Approach 1:
The patent utilizes the substrate plane (two-dimensional space) to route signal interconnections rather than requiring additional three-dimensional space. The combiner/divider network and interconnection traces are fabricated on the same aperture plate substrate as the antenna elements, efficiently utilizing the available planar space for both radiation elements and signal pathways.
Solution Approach 2:
The patent merges the signal interconnection network with the antenna element array by fabricating both on the same substrate. The combiner/divider network and antenna elements share the same physical platform, eliminating the need for separate interconnection structures and maximizing space utilization.
4Reliability
If transceiver modules are miniaturized and individually shielded for mmWave phased-array antenna, then mutual coupling is avoided, but manufacturing complexity and cost increase
Solution Approach 1:
The patent combines multiple transceiver module functions into integrated circuits that are mounted on the aperture plate substrate. Rather than individually shielding and separately mounting each transceiver module, the integrated circuits perform multiple functions (amplification, phase shifting, signal combining/dividing) in single components, reducing the number of discrete elements that would require individual shielding and simplifying manufacturing.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design reduces the cost and complexity of phased-array antenna systems while maintaining performance, enabling efficient signal distribution and control across multiple beams, and enhancing reliability in harsh conditions.
Implementation Method 1
the radio frequency current from the transmitter is fed to the individual antennas with the correct phase relationship so that the radio waves from the separate antennas add together to increase the radiation in a desired direction
Implementation Method 2
Such miniaturized antenna system can produce high beamforming gains through electrically steerable arrays generating directional transmissions
Implementation Method 3
The signal combiner/divider and distribution network, combines the received signals from multiple antenna elements and/or divides the transmit signal for multiple antenna elements
Data Source
AI summary
A low-cost implementation and a simplified digital signal control and synchronization for a multi-beam phased-array antenna is proposed. In a preferred embodiment, the multi-beam phased array antenna is implemented with a stack-up comprises 1) an antenna substrate aperture containing embedded antenna elements and a third layer of the signal combiner/divider and distribution network, 2) interposer substrate providing a second layer of the signal combiner/divider and distribution network and the carrier of BPU ICs, and 3) the BPU ICs containing the plurality of phased-array frontend processing unit and a first layer of the signal combiner/divider and distribution unit. In one advantageous aspect, the invention is to combine the third layer of the signal combiner/divider and distribution network with the antenna onto the same substrate, eliminating the use of expensive miniature high frequency connectors.