Multi-Beamlet Modulation Device Interconnect Structure
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Solution Overview
Problem
Charged particle multi-beamlet lithography systems face challenges in controlling beamlets with pitches smaller than 55 µm while maintaining reliability, and existing solutions are cumbersome and costly due to complex wiring structures and alignment issues.
Innovation Solution
A modulation device with a reduced pitch interconnect structure, where conductive elements extend over multiple levels, allowing for more efficient deflection with lower voltage requirements and increased deflection per unit voltage, and the use of Ge-diodes for high-speed operations, along with a method of manufacturing that includes chemically selective etching and anisotropic etching processes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a plurality of electron beamlets are used to transfer patterns at high speed, then productivity is improved, but device complexity increases due to the need for complex wiring structures and multiple substrates
Solution Approach 1:
The patent combines the wiring substrate and electrode substrate into a single integrated modulation device. The conductive elements are formed directly within the modulation device body, eliminating the need for separate wiring layers and multiple substrate bonding. This integration reduces the number of components and simplifies the overall wiring structure while maintaining the capability to control multiple beamlets for high-speed pattern transfer
Solution Approach 2:
The patent transitions from planar wiring structures to a three-dimensional arrangement where conductive elements are positioned at different locations within the modulation device body. This spatial arrangement in multiple dimensions allows for more efficient routing of electrical connections and reduces wiring complexity by utilizing the third dimension (depth) rather than only lateral routing
2Adaptability or versatility
If separate substrates are bonded to create multilayered wiring structure, then adaptability is improved, but manufacturing precision requirements increase due to alignment difficulties
Solution Approach 1:
The patent merges the wiring substrate and electrode substrate into a single integrated modulation device. The conductive elements are formed directly within the modulation device body, eliminating the need for separate wiring layers and multiple substrate bonding. This integration reduces the number of components and simplifies the overall wiring structure while maintaining the capability to control multiple beamlets for high-speed pattern transfer
Solution Approach 2:
The patent segments the modulation device into functional regions with conductive elements positioned at specific locations within the body. This segmentation allows different parts of the device to perform specialized functions (beamlet deflection, electrical connection, support) while maintaining a unified structure that eliminates alignment issues between separate substrates
3Productivity
If pitch between beamlets is reduced below 55 μm, then productivity is improved, but reliability deteriorates due to difficulties in controlling individual beamlets
Solution Approach 1:
The patent implements local quality by providing individual conductive elements for controlling each beamlet, with electrodes positioned at specific locations within the modulation device body. This localized control structure allows precise independent manipulation of each beamlet regardless of pitch, maintaining reliability even at reduced spacings below 55 μm
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables reliable control of beamlets with pitches as small as 10 µm or less, improving deflection efficiency and reducing the complexity and cost of the interconnect structure, while extending the lifetime of the beamlet stop array through even degradation.
Implementation Method 1
The electron beamlets generated by a radiation source are modulated in a modulation device by electrostatic deflection in accordance with pattern data
Implementation Method 2
the pattern data for controlling the electrostatic deflection are transferred at least partly using optical transmission using modulated light beams
Data Source
Figure 1~2
Figure 3a~4
Figure 5~6
AI summary
The invention relates to a modulation device for use in a charged particle multi -beamlet lithography system. The device includes a body comprising an interconnect structure 100) provided with a plurality of modulators and interconnects at different levels within the interconnect structure for enabling connection of the modulators to one or more pattern data receiving elements. A modulator includes a first electrode (132), a second electrode (134), and an aperture (135) extending through the body. The electrodes are located on opposing sides of the aperture for generating an electric field across the aperture. At least one of the first electrode and the second electrode includes a first conductive element (110) formed at a first level of the interconnect structure and a second conductive element (110) formed at a second level of the interconnect structure. The first and second conductive elements are electrically connected with each other.