Multi-Blade Trimming Tool for Semiconductor Wafer Edge Processing
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Solution Overview
Problem
The edge of semiconductor wafers often becomes warped, damaged, or unsuitable for electronic circuits during fabrication, necessitating trimming, which is inefficient and time-consuming due to the lack of effective tools for simultaneous trimming and blade maintenance.
Innovation Solution
A trimming tool with a multi-blade holder that rotates to allow for simultaneous trimming of multiple wafers and automatic blade dressing, utilizing sensors to monitor blade conditions and optimize the trimming process, thereby increasing efficiency and reducing processing time.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a single blade is used for trimming wafers, then the trimming process can be performed, but the processing rate is low and time-consuming
Solution Approach 1:
The trimming tool is divided into multiple independent blades (at least two blades) that can operate simultaneously on different wafers. Each blade can be independently dressed or replaced, allowing continuous operation without stopping the entire system for blade maintenance.
Solution Approach 2:
The blade holder is designed to accommodate multiple blades and can rotate to position different blades for trimming operations. The system can switch between trimming mode and blade dressing mode, providing multi-functionality in a single apparatus.
2Manufacturing precision
If blades are dressed frequently to maintain trimming quality, then wafer edge quality is improved, but processing time is reduced
Solution Approach 1:
Blade dressing is performed in advance during non-productive time periods or between batches, rather than interrupting the trimming process. The system prepares blades beforehand so they are ready for continuous trimming operations.
Solution Approach 2:
Multiple blades allow continuous trimming operations without interruption. While one blade is being dressed or replaced, other blades continue trimming wafers, maintaining uninterrupted productive action.
3Productivity
If multiple blades are used simultaneously, then processing efficiency is improved, but device complexity increases
Solution Approach 1:
Multiple blades are merged into a single rotating blade holder assembly, simplifying the overall structure compared to having separate trimming mechanisms for each blade. The blade holder integrates mounting, rotation, and positioning functions.
Solution Approach 2:
The blade holder is designed to rotate, allowing dynamic repositioning of blades between trimming and dressing operations. This rotational capability enables flexible blade selection and reduces the need for complex fixed-position mechanisms.
Data Source
AI summary
An apparatus includes a first platen configured to hold a first workpiece; a first dressing board; and blade holder including arms extending from a central axis, wherein the blade holder is configured to hold a blade at an end of each respective arm, wherein the blade holder is operable to rotate around the central axis, wherein the blade holder is configured to trim the first workpiece using at least one blade, wherein the blade holder is configured to dress at least one blade on the first dressing board.