Multi-Board Electronic Assembly with Thermal Support Structure
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing electronic system assemblies face challenges in efficiently integrating and supporting multiple electronic subsystems while maintaining thermal management and structural integrity, particularly in providing low ripple voltage outputs and independent operation of subsystems.
Innovation Solution
The electronic system assembly comprises multiple circuit boards with strategically positioned connectors and a thermally conductive support structure, forming a cuboid shape that encloses and supports the components, ensuring electrical coupling and thermal distribution, and includes power converters to achieve low ripple voltage outputs and independent operation of subsystems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple electronic subsystems are integrated into a single assembly, then functionality and versatility are improved, but structural complexity and integration difficulty increase
Solution Approach 1:
The electronic system is divided into multiple independent circuit boards, each hosting specific electronic subsystems. These modular boards can be independently designed, manufactured, and replaced, reducing integration complexity while maintaining system versatility. Each board acts as a self-contained unit with its own components and connectivity.
Solution Approach 2:
The circuit boards are designed with universal mounting features and standardized connector interfaces that enable multiple subsystems to be integrated using common structural and electrical connection mechanisms. This universality simplifies the integration process across different subsystem types while maintaining system functionality.
2Ease of operation
If multiple circuit boards are used to host electronic subsystems, then system modularity and maintainability are improved, but structural rigidity and thermal management challenges increase
Solution Approach 1:
The support structure incorporates localized reinforcement features at critical mounting points and thermal pathways. The structure provides enhanced rigidity where needed for board mounting while maintaining overall modularity. Thermal management is addressed through localized heat sinking and conductive pathways integrated into the support structure at specific high-heat-generation areas.
3Volume of moving object
If circuit boards are closely integrated to reduce assembly size, then space efficiency is improved, but thermal management and signal interference problems worsen
Solution Approach 1:
The circuit boards are arranged in a three-dimensional configuration utilizing vertical space and angled orientations rather than simple planar stacking. This dimensional arrangement reduces the horizontal footprint while increasing vertical separation between heat-generating components, improving thermal management without compromising space efficiency. The support structure incorporates angled mounting surfaces and multi-level positioning to achieve this spatial optimization.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enables efficient integration and support of multiple electronic subsystems, maintains low ripple voltage outputs, and allows for independent operation, enhancing thermal management and structural rigidity, thereby addressing the integration and support challenges in electronic system assemblies.
Implementation Method 1
The support structure is comprised of a thermally conductive material and, when the electronic system assembly is assembled, the plurality of pillars are each in contact with or adjacent to one or more components of the plurality of electronic components
Data Source
AI summary
An electronic system assembly can include a plurality of first circuit boards including a plurality of electronic components provided on first surfaces of the plurality of first circuit boards, a second circuit board including a set of first connectors on a second surface, and a third circuit board including a set of second connectors on a third surface. The first surfaces, a fourth surface of the second circuit board opposite to the second surface, and a fifth surface of the third circuit board opposite to the third surface can define a cavity containing the plurality of electronic components. The set of first connectors and the set of second connectors can be electrically coupled to the plurality of electronic components.