Multi-Bond Wire Fuse Connection for High Transient Current
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Solution Overview
Problem
The bond wire connection in packaged electronic devices with integrated fuse circuitry can fail before the fuse blows during large current and voltage transients, leading to uncontrolled failure, and increasing bond wire diameter requires larger bond pads, which is not feasible.
Innovation Solution
A multi-bond stack configuration where multiple bond wires are stacked and connected to the same bond pad without increasing the bond pad size, enhancing current carrying capability by increasing the number of bond wires without additional bond pads or die area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the bond wire diameter is increased to increase current carrying capability, then the current carrying capability is improved, but the bond pad size must be increased
Solution Approach 1:
The bond wire connection is segmented into multiple separate bond wires (first bond wire and second bond wire) instead of using a single thick bond wire. Each bond wire connects to the same bond pad, distributing the current load across multiple conductors. This allows the current carrying capability to be increased without requiring a larger bond pad area, as each individual bond wire maintains a standard diameter while collectively handling higher current through parallel conduction paths.
2Power
If multiple bond wires are used to increase current carrying capability, then the current carrying capability is improved, but the device complexity increases
Solution Approach 1:
The first and second bond wires perform the same function (connecting the bond pad to the conductive terminal) and are configured identically in terms of their routing and connection points. This uniform, modular approach simplifies the manufacturing process and reduces complexity compared to designing unique interconnection paths for each conductor. The repetitive, standardized configuration allows for easier fabrication and testing while achieving the desired current carrying capability through parallel connections.
Data Source
AI summary
An electronic device has a fuse circuit including a semiconductor die and first and second bond wires, the semiconductor die having a bond pad and a fuse, the fuse having first and second portions, the bond pad coupled to the first portion of the fuse, and the second portion of the fuse coupled to a protected circuit, the first bond wire having a first end coupled to the bond pad and a second end coupled to a conductive terminal, and the second bond wire having a first end coupled to the second end of the first bond wire and a second end coupled to the conductive terminal.