Multi-Branch Switch Node Connector for Uniform Current Flow
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Solution Overview
Problem
Power semiconductor modules with non-homogeneous current flow in switch node connections between transistor devices lead to increased power losses and package resistance, especially at higher switching frequencies due to eddy currents.
Innovation Solution
A semiconductor module design with a switch node connector featuring two or more branches that distribute current uniformly, providing a secondary current path to balance and smooth out non-homogeneous DC current distributions, reducing hot spots and power loss density.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If a single-branch switch node connector is used, then the structure is simple, but the current density distribution is non-homogeneous leading to increased power losses and package resistance
Solution Approach 1:
The switch node connector is divided into multiple branches (typically two branches) that are arranged in parallel between the high side switch and low side switch. This segmentation allows current to flow through multiple paths simultaneously, distributing the current density more uniformly across the connector and reducing localized heating and power losses.
2Loss of energy
If the switch node connector has non-homogeneous current flow, then the structure is simple, but power loss density increases with hot spots
Solution Approach 1:
Different branches of the switch node connector are designed with different cross-sectional areas and routing paths to optimize local current distribution. The branches are positioned and dimensioned to ensure that current density is homogenized across the entire connector, preventing hot spots in high-current-density regions while maintaining adequate current carrying capacity in all paths.
3Productivity
If switching frequency increases, then the power stage performance improves, but eddy currents increase causing non-uniform current density
Solution Approach 1:
The multi-branch structure segments the current path into multiple parallel routes, which reduces the effective loop area for eddy current circulation. This segmentation disrupts the formation of large eddy currents that would otherwise be generated at high switching frequencies, thereby reducing eddy current losses and maintaining more uniform current density distribution even at MHz-range switching frequencies.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances current flow homogeneity, decreases power losses, and reduces package resistance, improving the efficiency and reliability of power stages without increasing loop inductance, suitable for both embedded chip and leadframe-based technologies.
Implementation Method 1
The switch node connector comprises two or more branches that have an arrangement with respect to the low side switch and to the high side switch and that each have a cross-sectional area. The arrangement and the cross-sectional area of the two or more branches are selected so as to homogenise the current density distribution within the switch node connector.
Implementation Method 2
Since non-uniformities in the current density distribution tend to increase with an increase in switching frequency due to the generation of eddy currents, the semiconductor module may be useful for devices with a driver frequency in the MHz range.
Data Source
AI summary
A semiconductor module is provided that includes a low side switch, a high side switch and a control chip. The low side switch and the high side switch are arranged laterally adjacent one another and coupled by a switch node connector to form a half bridge circuit. The switch node connector includes two or more branches that have an arrangement with respect to the low side switch and to the high side switch and that each have a cross-sectional area.