Multi-branch Terminal for IC Package Noise Immunity
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Solution Overview
Problem
In integrated circuit (IC) packages, particularly in alternator circuits, the need for separate installation of capacitors and transistor outline (TO) packages results in increased housing size, complex mounting processes, and reduced noise immunity due to longer distances between components.
Innovation Solution
A multi-branch terminal within the IC package enables both active and passive bonding, allowing a capacitor to be embedded within the package, simplifying installation and reducing housing size while improving noise immunity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If separate installation of capacitors and TO packages is used, then component functionality is achieved, but housing size increases and mounting process becomes complex
Solution Approach 1:
The patent combines the capacitor and TO package into a single integrated housing, eliminating the need for separate installations. The multi-branch terminal structure allows both components to be mounted on the same housing with shared bonding infrastructure, reducing overall complexity while maintaining functionality.
Solution Approach 2:
The housing serves multiple functions simultaneously: it houses both the capacitor and TO package, provides shared bonding connections through the multi-branch terminal, and reduces overall space requirements. This multi-functional design eliminates the need for separate mounting structures.
2Reliability
If separate installation of capacitors and TO packages is used, then component functionality is achieved, but noise immunity reduces due to longer distances between components
Solution Approach 1:
By integrating the capacitor and TO package into a single housing with a multi-branch terminal, the physical distance between components is minimized. This close proximity significantly improves noise immunity while the shared bonding infrastructure simplifies the installation process to a single mounting operation.
3Volume of stationary object
If standard capacitor embedding is implemented, then housing size reduces and materials are conserved, but bonding complexity increases
Solution Approach 1:
The terminal is divided into multiple branches, each handling specific bonding connections. This segmentation allows the capacitor to be embedded within the housing while maintaining organized, manageable bonding pathways to different terminals, reducing overall complexity despite the integrated design.
Solution Approach 2:
The capacitor is nested within the housing structure, utilizing the internal space efficiently. The multi-branch terminal provides organized connection pathways that route bonds from the embedded capacitor to external terminals, managing complexity through structured spatial arrangement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The multi-branch terminal simplifies the mounting process, reduces housing volume, conserves materials, and enhances signal quality by embedding a standard capacitor close to the IC chip, thereby improving noise immunity and reducing noise emission.
Implementation Method 1
the active bonding may include a wire bonded to the chip of the IC
Implementation Method 2
the passive bonding may include a capacitor bonded to the second branch and a first terminal of the IC
Data Source
AI summary
An example multi-branch terminal for an integrated circuit (IC) package is described herein. An example multi-branch terminal of an integrated circuit (IC), may include a first branch that may include an active bonding with a chip of the IC, wherein the active bonding may include a wire bonded to the chip of the IC; and a second branch that may include a passive bonding with the chip of the IC, wherein the passive bonding may include a capacitor bonded to the second branch and a first terminal of the IC.