Multi-Bridge Substrate Packaging for Compact Signal Routing
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Solution Overview
Problem
Current semiconductor technologies face challenges in achieving a small form factor by efficiently packaging multiple chips and components in limited spaces, as existing packaging methods do not effectively utilize the available space for optimal functionality and signal transmission.
Innovation Solution
A semiconductor device with a substrate featuring a multi-bridge structure, where a first bridge is connected to the first redistribution layer on one surface and a second bridge is connected to the second redistribution layer on the opposite surface, along with an adhesive film between them, allowing for efficient signal transmission and component integration within the substrate's cavities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple chips and components are packaged in a limited space using conventional methods, then the device density increases, but the space utilization and signal transmission efficiency deteriorate
Solution Approach 1:
The patent utilizes the thickness direction (z-axis) of the substrate by forming cavities that extend through the substrate thickness, allowing multi-bridge structures to be packaged vertically rather than only horizontally. This dimensional transition from 2D planar packaging to 3D vertical packaging enables more efficient space utilization while maintaining signal transmission quality.
Solution Approach 2:
The multi-bridge structure is nested within the cavity formed in the substrate, with the adhesive film positioned between the bridges. This nesting arrangement allows multiple functional elements to be compactly integrated within the limited substrate volume, increasing device density without compromising signal transmission efficiency.
2Quantity of substance
If multiple chips and components are packaged in a limited space using conventional methods, then the device density increases, but the signal transmission efficiency deteriorates
Solution Approach 1:
The signal transmission path is segmented into multiple independent bridges rather than using a single long trace. Each bridge provides a dedicated transmission channel, reducing signal interference and maintaining transmission efficiency even as more components are integrated into the limited space.
Solution Approach 2:
The adhesive film is selectively positioned between specific bridges to provide localized insulation and signal isolation only where needed, rather than uniformly across the entire substrate. This localized approach maintains signal transmission efficiency while enabling dense component packaging.
3Area of stationary object
If a multi-bridge structure is packaged in a substrate cavity, then the space utilization improves, but the manufacturing complexity increases
Solution Approach 1:
The cavity is formed in the substrate before the multi-bridge structure is assembled and packaged into it. This preliminary cavity formation allows for easier subsequent assembly of the bridge structure without requiring complex post-processing steps, thereby reducing overall manufacturing complexity despite the improved space utilization.
4Stability of the object's composition
If a multi-bridge structure with adhesive film is used, then the structural stability improves, but the manufacturing precision requirements increase
Solution Approach 1:
The adhesive film serves as an intermediary element between the bridges, providing a tolerant bonding interface that accommodates minor positioning variations during manufacturing. This intermediary layer maintains structural stability while reducing the stringency of positioning precision requirements compared to direct rigid bonding.
Data Source
AI summary
A semiconductor device is described, in which a multi-bridge is packaged in a substrate to improve a small form factor. The semiconductor device comprises a substrate including a first surface and a second surface, which face each other, and defining a first cavity passing through the first surface and the second surface, a first redistribution layer structure formed on the first surface of the substrate, a second redistribution layer structure formed on the second surface of the substrate, a connection terminal disposed on the second redistribution layer structure, and a multi-bridge packaged in the first cavity, including a first bridge facing the first surface and electrically connected to the first redistribution layer structure and a second bridge facing the second surface and electrically connected to the second redistribution layer structure.