Multi-Cable Connector Module With Integrated Substrate Grounding

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Solution Overview

Problem

Existing methods for connecting multiple communication cables are time-consuming and costly due to the need for individual connections of insulation displacement connectors to each wire, making them inefficient for multi-cable connections.

Innovation Solution

The development of multi-cable communication connectors and port modules that utilize substrates with integrated circuitry and insulation displacement connectors to securely connect multiple cables in a single assembly, reducing the complexity and time required for installation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If multiple male and female connectors are used to create separate communication connections for each cable, then reliable individual cable connections are achieved, but the installation process becomes time-consuming and expensive

Engineering Contradiction:
Improveconnection reliabilityVSAvoidinstallation time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The patent combines multiple individual connector functions into a single integrated port module that can accommodate multiple cables simultaneously. The module integrates multiple insulation displacement connectors and cable management features into one unified structure, allowing multiple cable connections to be established through a single installation process rather than requiring separate connectors for each cable.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The port module is designed as a universal connector that can handle multiple different cable connections through its multiple outlets and integrated insulation displacement connectors. A single module performs the functions of what would traditionally require multiple separate connectors, providing multi-functionality that reduces both installation time and component count.

Inventive Principle:
Principle #6Universality (Multi-functionality)

2Manufacturing precision

If multiple individual insulation displacement connectors are used for each cable, then proper wire connection is achieved, but the complexity and cost of implementation increases

Engineering Contradiction:
Improvewire connection precisionVSAvoidconnector complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The patent merges multiple insulation displacement connectors into a single integrated module structure. The module contains multiple IDCs that are pre-positioned and interconnected through a substrate, maintaining the precision wire connection capability of individual IDCs while reducing the overall complexity by providing a unified housing, cable management system, and installation interface.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The port module is segmented into functional sections with each outlet having its own insulation displacement connectors for precise wire connections, while the overall module provides integrated cable management and structural support. This segmentation allows precise wire-level connections to be maintained while the module-level integration reduces complexity.

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS8235731B1Connector module and patch panel
Publication Date: 2012.08.07 LEVITON MFG CO INC
  • US8235731B1 patent drawing
  • US8235731B1 patent drawing
  • US8235731B1 patent drawing

AI summary

A substrate operable to construct a male-type connector, a female-type connector, and/or a multi-outlet module. The substrate has a plurality of circuits and an edge card male connector including contacts for each circuit. For each circuit, the substrate has a ground plane connected to one or more of the contacts for the circuit. The ground planes may be implemented as localized, electrically floating, isolated ground planes. The substrate may include multiple layers upon which portions of the circuits and ground planes may be disposed. The ground plane corresponding to each of the plurality of circuits may be located in close proximity to conductive elements of the circuit so as to provide a localized common ground to which energy can be conveyed from the conductive elements to thereby limit an amount of energy radiated outwardly from the conductive elements to surrounding conductors.