Multi-Camera Sensor Array Overlapping Seams
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Solution Overview
Problem
Current high-resolution electronic cameras face challenges in achieving seamless image transitions between multiple sensor chips, leading to gaps and high manufacturing costs, while scanning sensors suffer from distortions and limited imaging flexibility, especially in aerial photography.
Innovation Solution
Assembling a plurality of sensors on a carrier with overlapping imaging areas to eliminate gaps and using a processor to correct displacement and rotation errors, allowing for the creation of a large format, high-resolution image with reduced manufacturing costs and improved flexibility.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If multiple sensor chips are butted together to increase resolution, then the sensor coverage area increases, but gaps appear between chips and image transitions become non-smooth
Solution Approach 1:
The patent divides the sensor array into multiple independent sensor chips that can be manufactured separately and then assembled together. Each chip images a portion of the object with overlapping coverage, allowing the system to achieve large area coverage while maintaining image quality through post-processing stitching of the overlapping regions.
2Manufacturing precision
If sensor chips are tightly arranged to minimize seams, then gap reduction is achieved, but chip replacement becomes nearly impossible
Solution Approach 1:
The patent creates a modular sensor system where individual sensor chips are discrete, independently replaceable units mounted on a common carrier. The overlapping imaging areas provide mechanical and optical tolerance that enables easy removal and replacement of failed chips without affecting the entire sensor array.
3Measurement precision
If a single sensor chip with very large pixel arrays is used, then resolution increases, but manufacturing cost increases significantly
Solution Approach 1:
The patent achieves high resolution by assembling multiple standard-resolution sensor chips rather than manufacturing a single large high-resolution chip. This segmentation allows use ofๆ็, cost-effective standard sensor manufacturing processes while achieving the equivalent resolution of a much larger single chip through the combined array.
Solution Approach 2:
The patent combines multiple standard sensor chips into a unified large-format sensor system with overlapping fields of view. The individual chip images are merged through image stitching algorithms that utilize the overlapping regions to create a seamless high-resolution composite image equivalent to a single large sensor.
4Area of stationary object
If scanning type sensors are used to cover larger areas, then field of view increases, but image distortions become significant
Solution Approach 1:
The patent divides the large field of view into multiple smaller sub-fields, each captured by an individual sensor chip with its own lens. Each chip-lens combination is optimized for its specific field of view, minimizing distortions within each sub-image. The segmented approach allows each sensor to operate in its optimal performance range.
Data Source
AI summary
A method of making a high resolution camera includes assembling, imaging and processing. The assembling includes assembling on a carrier a plurality of sensors. Each sensor is for imaging a portion of an object. The plurality of sensors are disposed so that the portions imaged by adjacent sensors overlap in a seam leaving no gaps between portions. The imaging images a predetermined known pattern to produce from the plurality of sensors a corresponding plurality of image data sets. The processing processes the plurality of image data sets to determine offset and rotation parameters for each sensor by exploiting overlapping seams.