Multi-Carrier Package Structure for Thermal Management
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Solution Overview
Problem
Conventional package structures face challenges with high manufacturing costs, limited space for wiring, and poor heat dissipation due to small electronic components and limited heat transfer capabilities, which restricts their size and efficiency in electronic devices.
Innovation Solution
A package structure comprising a first carrier with higher thermal resistance and a second carrier with lower thermal resistance, where high heat generation components are placed on the second carrier for direct heat transfer, and the first carrier has a high wiring density to accommodate more components, enhancing heat dissipation and reducing volume.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of stationary object
If electronic components are made small to increase component distribution density, then volume is reduced, but heat dissipation capacity deteriorates
Solution Approach 1:
The package structure is divided into multiple carriers (first carrier and second carrier), each capable of independently dissipating heat. This segmentation allows heat from multiple components to be distributed across different thermal pathways, preventing heat accumulation while maintaining compact volume.
Solution Approach 2:
The patent transitions from a single-plane component arrangement to a three-dimensional multi-carrier structure. Components are distributed across multiple carriers stacked or arranged in different spatial dimensions, increasing the effective heat dissipation surface area without proportionally increasing the overall package volume.
2Device complexity
If a single carrier is used to reduce device complexity, then manufacturing is simplified, but heat dissipation capacity deteriorates
Solution Approach 1:
The thermal management function is segmented across multiple carriers rather than concentrated in a single carrier. Each carrier acts as an independent thermal management unit with its own heat dissipation pathways, allowing heat to be distributed and dissipated more effectively throughout the package structure.
Solution Approach 2:
Each carrier serves multiple functions: mechanical support for electronic components, electrical connection substrate, and thermal management element. This multi-functionality allows the multi-carrier structure to provide enhanced heat dissipation without proportionally increasing device complexity.
3Ease of manufacture
If heat is transferred through conductive via only, then manufacturing is simplified, but heat dissipation capacity deteriorates
Solution Approach 1:
The heat transfer function is segmented into multiple parallel pathways distributed across different carriers rather than relying on a single conductive via path. This segmentation creates redundant thermal pathways that collectively provide superior heat dissipation capacity.
Solution Approach 2:
Heat transfer transitions from primarily vertical conduction through conductive vias to include lateral heat spread across multiple carrier surfaces and through multiple stacked carrier layers. This multi-dimensional heat transfer approach significantly increases the effective heat dissipation area and capacity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration allows for efficient heat dissipation, reduced volume, and automatic assembly, improving the package structure's performance and manufacturing efficiency.
Implementation Method 1
the heat is transferred to leads of the next level electronic device only through a conductive via 214 in the package substrate 210 by way of heat conduction
Data Source
AI summary
A package structure including a first carrier, a second carrier, at least a first electronic component and at least a second electronic component is provided. The second carrier is electrically connected to the first carrier. The first electronic component is disposed on the first carrier and electrically connected to the first carrier. The second electronic component is disposed on the second carrier and electrically connected to the second carrier.