Multi-Cavity Heat Dissipator for Balanced Liquid Cooling
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Solution Overview
Problem
Current liquid cooling systems for electronic devices require multiple heat dissipators, occupying significant space and causing uneven flow distribution and increased flow resistance, which reduces cooling efficiency.
Innovation Solution
A heat dissipator with a compact structure featuring a base body containing liquid distribution, collection, and exchange cavities, along with multiple heat exchange cavities and cooling plates, to efficiently cool multiple components while minimizing space and resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple heat dissipators are connected in series to cool multiple chips, then each chip can be cooled individually, but the space occupation increases and flow distribution becomes uneven
Solution Approach 1:
The patent merges multiple heat dissipation functions into a single integrated heat dissipator. The base body contains multiple heat exchange cavities (first heat exchange cavity, second heat exchange cavity, etc.) that can simultaneously cool multiple chips or heat generating components. The liquid distribution cavity distributes cooling liquid to multiple heat exchange cavities, and the liquid collection cavity collects the cooled liquid, forming a unified cooling system that replaces multiple separate heat dissipators.
Solution Approach 2:
The heat dissipator is designed with multi-functionality to perform multiple heat dissipation tasks simultaneously. Each heat exchange cavity can be independently configured to cool different chips or components, while sharing common liquid distribution and collection systems. This universal design allows the single heat dissipator to replace multiple specialized heat dissipators.
2Reliability
If multiple heat dissipators are used to cool multiple chips, then comprehensive cooling coverage is achieved, but flow resistance increases
Solution Approach 1:
By merging multiple heat dissipation paths into a single integrated structure with shared liquid distribution and collection cavities, the patent reduces the total number of flow paths and connections required. This consolidation decreases cumulative flow resistance compared to using multiple separate heat dissipators connected in series.
3Reliability
If multiple heat dissipators are configured to cool multiple components, then cooling capacity is sufficient, but the structure becomes complex
Solution Approach 1:
The patent integrates multiple heat exchange cavities, liquid distribution channels, and liquid collection channels into a single base body structure. This unified design eliminates the need for multiple separate heat dissipator units and their associated mounting structures, pipes, and connections, thereby reducing overall structural complexity while maintaining sufficient cooling capacity for multiple components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides balanced heat dissipation for multiple components, reducing the number of required heat dissipators and improving cooling efficiency by optimizing flow distribution and increasing heat dissipation surfaces.
Implementation Method 1
a liquid inlet and a liquid outlet, the liquid inlet is communicated with the liquid distribution cavity, and the liquid outlet is communicated with the liquid collection cavity
Implementation Method 2
an outer surface of each of the heat exchange cavities is provided with a heat dissipation surface
Data Source
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AI summary
This application provides a heat dissipator, a heat dissipation apparatus, and an electronic device, and relates to the field of electronic device technologies, to resolve a technical problem of poor heat dissipation performance of the heat dissipator. The heat dissipator provided in this application includes a base body, and a liquid distribution cavity, a liquid collection cavity, and a heat exchange cavity that are located in the base body. The base body is provided with a liquid inlet end and a liquid outlet end. The liquid distribution cavity is located in the base body, and a first end of the liquid distribution cavity is communicated with the liquid inlet end. The liquid collection cavity is located in the base body, and a first end of the liquid collection cavity is communicated with the liquid outlet end. The heat exchange cavity is located in the base body and is provided with a liquid inlet and a liquid outlet. The liquid inlet is communicated with the liquid distribution cavity, and the liquid outlet is communicated with the liquid collection cavity. A plurality of heat exchange cavities are provided, and an outer surface of each of the heat exchange cavities is provided with a heat dissipation surface. In the heat dissipator provided in embodiments of this application, at least two heat exchange cavities may be provided, and an outer surface of each of the heat exchange cavities is provided with a heat dissipation surface. Therefore, the heat dissipator can cool at least two to-be-cooled components. This helps reduce a quantity of configured heat dissipators and reduce flow resistance.