Multi-Cavity LED Ceramic Base with Integral Lens Sealing
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Solution Overview
Problem
Conventional LED modules face issues with high assembly time and cost due to the need for individual sealing of lenses, substrate strength, and low yield rates caused by dense slot arrangements, which limit their ability to provide irregular illumination and maintain light extraction efficiency.
Innovation Solution
A Multi-Cavities light emitting device with a ceramic base featuring a central slot and side slots spaced greater than 0.5mm, using a blue LED chip covered by a yellow or green phosphor layer for warm white light emission, and an integrally sealed lens to reduce assembly time and enhance light extraction efficiency, while maintaining substrate strength.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If lenses are combined with LED chips one by one, then each LED chip can be sealed individually, but the overall assembling time and cost will be increased
Solution Approach 1:
The patent combines multiple sealing operations into a single integral lens structure that seals multiple LED chips simultaneously. The lens is designed as one piece that covers and seals several LED chips in one assembly step, eliminating the need for individual sealing operations for each chip.
Solution Approach 2:
The integral lens serves multiple functions: it acts as a sealing structure for multiple LED chips, provides optical focusing, and protects the chips simultaneously. This multi-functional design reduces the number of separate components and assembly steps required.
2Productivity
If a large number of slots are densely disposed on the substrate, then more LED chips can be mounted, but the strength of the substrate will be affected adversely and it may be cracked or broken easily
Solution Approach 1:
The patent divides the substrate into multiple isolated slots rather than creating a dense grid pattern. Each slot is independently formed and separated by sufficient spacing, allowing the substrate to maintain structural integrity while still accommodating multiple LED chips.
Solution Approach 2:
The substrate structure is optimized locally at each slot position with specific dimensional parameters (slot width, depth, and spacing) that ensure both chip mounting capability and overall substrate strength. The slots are designed with appropriate dimensions to provide local support while maintaining global structural integrity.
3Productivity
If a large number of slots are densely disposed on the substrate, then more LED chips can be mounted, but the yield rate will be reduced due to substrate cracking or breaking
Solution Approach 1:
By segmenting the substrate into well-spaced isolated slots rather than dense arrangements, the patent reduces stress concentration and prevents crack propagation, thereby improving manufacturing yield while maintaining chip mounting capacity.
4Ease of operation
If symmetric matrix arrangement of slots is used, then regular illumination can be achieved, but irregular illumination cannot be provided
Solution Approach 1:
The patent employs asymmetric slot arrangements and varying slot dimensions to create different illumination patterns. By adjusting the position, size, and distribution of individual slots, the system can generate both regular and irregular illumination patterns to meet different application requirements.
Solution Approach 2:
Different regions of the substrate have slots with different characteristics (size, shape, spacing) to create localized illumination variations. This allows the system to produce customized illumination patterns with different degrees of regularity across different areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution improves light extraction efficiency, reduces assembly time and cost, and increases yield rates by using a ceramic base and integrally sealing the lens, allowing for more flexible optical design and maintaining substrate integrity.
Implementation Method 1
a blue LED chip covered by a plastic layer containing a yellow or green phosphor, so as to emit a warm white light
Data Source
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AI summary
A Multi-Cavities light emitting device includes a base (10), a first light emitting unit (20), at least two second light emitting units (30), a light conversion layer (40) and a lens (50), and the base (10) has a central slot (11) and at least two side slots (12) symmetrically formed on external sides of the central slot (11), and the central slot (11) and the side slots (12) are formed in an area greater than 50% of the area of the base (10), and the first light emitting unit (20) is installed in the central slot (11), and the two second light emitting units (30) are installed in the at least two side slots (12) respectively, so as to achieve the effects of improving the light extraction efficiency of an LED chip and the yield rate of the product and reducing the overall assembling time and cost.