Multi-cavity Shielding Device with Variable Depth Cover
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Solution Overview
Problem
Conventional electromagnetic shielding devices have a uniform height and thickness, making it difficult to accommodate electronic components of varying heights, leading to a large size that impedes the miniaturization of electronic devices.
Innovation Solution
A multi-cavity electromagnetic shielding device with a metal frame and a dielectric cover body having a conductive material layer, where the cover body is formed by injection molding to accommodate electronic components of different heights, allowing for adjustable depth and thickness, enabling effective electrical contact and miniaturization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If a metal cover with uniform height and thickness is used, then the electromagnetic shielding device can be easily manufactured, but the device size becomes large and cannot accommodate components of varying heights
Solution Approach 1:
The patent applies local quality by transitioning from a uniform metal cover to a dielectric cover body with locally varied thickness. The cover body has different thicknesses in different regions (first thickness in first region, second thickness in second region) to accommodate electronic components of different heights. This allows the shielding device to adapt to varying component heights while maintaining ease of manufacture through injection molding, resolving the contradiction between manufacturability and device size.
Solution Approach 2:
The patent employs composite materials by combining a dielectric cover body with a conductive material layer. The dielectric cover body provides the structural form with variable thickness for miniaturization, while the conductive material layer attached to its outer surface provides the necessary electromagnetic shielding function. This composite structure enables both size reduction and effective shielding, resolving the contradiction between device size and shielding performance.
2Ease of manufacture
If a metal cover with uniform height is used, then the manufacturing process is simple, but it is difficult to accommodate electronic components of different heights
Solution Approach 1:
The patent applies local quality by transitioning from a uniform metal cover to a dielectric cover body with locally varied thickness. The cover body has different thicknesses in different regions (first thickness in first region, second thickness in second region) to accommodate electronic components of different heights. This allows the shielding device to adapt to varying component heights while maintaining ease of manufacture through injection molding, resolving the contradiction between manufacturability and device size.
3Reliability
If the cover height is increased to accommodate taller components, then all components can be covered, but the device size increases and miniaturization is impeded
Solution Approach 1:
The patent applies local quality by transitioning from a uniform metal cover to a dielectric cover body with locally varied thickness. The cover body has different thicknesses in different regions (first thickness in first region, second thickness in second region) to accommodate electronic components of different heights. This allows the shielding device to adapt to varying component heights while maintaining ease of manufacture through injection molding, resolving the contradiction between manufacturability and device size.
Solution Approach 2:
The patent applies dimensionality change by transitioning from a uniform-height cover to a variable-thickness cover. The cover body has different thicknesses in different regions (first thickness in first region, second thickness in second region), creating a three-dimensional adaptive structure that conforms to components of varying heights without increasing the overall device footprint, thus enabling miniaturization while maintaining shielding effectiveness.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for effective electromagnetic shielding while enabling the miniaturization of electronic devices by accommodating components of varying heights and preventing short circuits, facilitating the fabrication of devices with desired dimensions.
Implementation Method 1
a conductive material layer attached to the outer surface of the dielectric cover body... such that the conductive material layer is in electrical contact with the looped surrounding wall of the metal frame
Data Source
AI summary
An electromagnetic shielding device includes a metal frame mounted on a circuit board and having a looped surrounding wall configured with an inner space divided into first and second space portions by a partition wall unit. A cover is mounted fittingly into the inner space in the metal frame, and includes a dielectric cover body, and a conductive material layer attached to an outer surface of the cover body. The cover body has a looped surrounding wall extending downwardly from a periphery of a top wall and disposed in proximity to the looped surrounding wall of the metal frame such that the conductive material layer is in electrical contact with the looped surrounding wall of the metal frame. The cover cooperates with the metal frame to define first and second cavities having different depths and corresponding respectively to the first and second space portions.