Multi-Cell Power Conversion Module Stacked Architecture
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current power supply systems for high-current semiconductor devices like CPUs and GPUs face challenges in efficiently delivering power due to high current requirements, which leads to complex packaging and thermal management issues, limiting the maximum voltage and increasing the number of connector pins needed, thus complicating both power and signal connections.
Innovation Solution
A method involving a multi-cell power conversion module with conversion circuitry arranged in a specific pattern and an interconnection module with alternating terminal spacings to provide electrical and mechanical translation, allowing for efficient power delivery to semiconductor devices with reduced interconnection inductance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If high current requirements for VLSI semiconductor dies are met using traditional power supply systems, then power delivery to the semiconductor device is achieved, but the number of connector pins and leads required increases significantly, complicating package design
Solution Approach 1:
The power supply system is divided into multiple independent power modules, each capable of delivering high current through fewer pins. Multiple power modules are distributed across the substrate to collectively serve the entire semiconductor die, reducing the pin count requirement per module and overall package complexity.
Solution Approach 2:
The patent transitions from planar power distribution to three-dimensional stacked architecture. Power modules are vertically stacked above the substrate with interlayer connections, enabling high current delivery through vertical interconnects rather than requiring numerous horizontal connector pins, thus simplifying package design.
2Power
If high currents are delivered through traditional power connections, then power requirements of CPU/GPU are satisfied, but thermal management becomes difficult due to power dissipation limits
Solution Approach 1:
The power delivery function is segmented across multiple power modules distributed throughout the substrate. Each module handles a portion of the total current, distributing power dissipation across multiple locations rather than concentrating thermal load in a single area, thereby improving thermal management.
Solution Approach 2:
The stacked three-dimensional architecture provides direct vertical thermal pathways from power modules to heat sinks or thermal management structures. This vertical arrangement enables efficient heat extraction from high-current regions without requiring complex lateral thermal conduction paths.
3Power
If large number of connector pins are used to carry high currents, then power delivery is achieved, but signal connection requirements become more complex and maximum voltage is limited
Solution Approach 1:
Power and signal connections are segmented into separate functional paths. Power modules handle current delivery through dedicated power pins, while signal connections use separate dedicated signal paths. This separation eliminates the need for high-current-capable signal pins and reduces overall connection complexity.
Solution Approach 2:
The stacked architecture separates power and signal domains vertically. Power connections are established through vertical interlayer vias in the power modules, while signal connections remain in the substrate plane. This spatial separation allows independent optimization of power and signal paths without mutual interference.
4Power
If traditional power supply architecture is used near the point of load, then power conversion is achieved, but space on customer circuit board is excessive
Solution Approach 1:
The power modules are nested directly onto the substrate in a stacked configuration, with the substrate serving as the base layer and power modules positioned vertically above it. This nesting eliminates the need for separate planar power supply components on the circuit board, minimizing the overall footprint.
Solution Approach 2:
The patent moves power conversion functionality from the two-dimensional circuit board plane into the third dimension by stacking power modules vertically above the substrate. This vertical integration consolidates power conversion space within the substrate assembly rather than requiring additional board area.
Data Source
AI summary
Encapsulated electronic modules having complex contact structures may be formed by encapsulating panels containing a substrate comprising pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within terminal holes and other holes drilled in the panel within the boundaries of the cut lines. Slots may be cut in the panel along the cut lines. The interior of the holes, as well as surfaces within the slots and on the surfaces of the panel may be metallized, e.g. by a series of processes including plating. Solder may be dispensed into the holes for surface mounting. Two or more panels may be stacked prior to singulation to form module stacks. Multi-cell converters having a large cell pitch may be combined with an interconnection module to provide vertical power delivery to semiconductor devices through a semiconductor power grid having a small pitch. The converters and interconnection modules may be fabricated in panels and stacked prior to singulation.