Multi-Ceramic Electrostatic Chuck Structure to Reduce Disc Cracking
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Solution Overview
Problem
Current electrostatic chucks in semiconductor manufacturing face complications due to the mechanical securing of porous plugs within ceramic discs, which can lead to cracking and manufacturing challenges.
Innovation Solution
A substrate support carrier design featuring multiple ceramic discs with embedded clamp electrodes and resistive heaters, utilizing a bonding layer and porous plugs that extend through the discs, along with electrical feedthroughs and bond edge protection features to secure and thermally couple the discs, reducing mechanical stress and enhancing operational reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single ceramic disc with mechanically secured porous plug is used, then the structure is simpler, but the risk of cracking and manufacturing complications increases
Solution Approach 1:
The single ceramic disc is divided into multiple ceramic discs (first ceramic disc, second ceramic disc, third ceramic disc) with the porous plug extending through all of them. This segmentation distributes the mechanical stress and eliminates the need for press-fitting or gluing the porous plug into a single disc, thereby reducing cracking risk while maintaining structural integrity.
2Stability of the object's composition
If porous plug is secured by press-fit or interference fit, then the porous plug is held in place, but careful machining and additional complications are required
Solution Approach 1:
The porous plug is divided into multiple segments that extend through multiple ceramic discs. Each segment is held in place by the surrounding ceramic structure, eliminating the need for press-fit or interference fit mechanisms. This segmentation approach simplifies manufacturing by removing the need for careful machining while maintaining stable positioning of the porous plug.
3Reliability
If multiple ceramic discs are used with bonding layers, then manufacturing is simplified and cracking risk is reduced, but additional bonding layers and features are added
Solution Approach 1:
The electrostatic chuck is segmented into multiple ceramic discs connected by bonding layers. This segmentation improves reliability by distributing stress and reducing cracking risk, while the bonding layers provide a simple connection method that integrates the multiple components into a cohesive structure.
Solution Approach 2:
Bonding layers are introduced as intermediary elements between the multiple ceramic discs. These bonding layers facilitate the connection between discs, allowing the structure to achieve high reliability through stress distribution while managing the complexity of having multiple components through a standardized connection method.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design simplifies manufacturing, reduces the risk of ceramic disc cracking, and improves the operational reliability of electrostatic chucks by securely embedding porous plugs and ensuring effective thermal and electrical connections, thereby enhancing the overall performance and durability of the substrate support carrier.
Implementation Method 1
electrostatic chucks are used to support a substrate in a processing chamber
Implementation Method 2
resistive heaters are embedded therein
Data Source
AI summary
A substrate support carrier includes an electrostatic chuck (ESC) assembly includes a top ceramic disc having a recess formed from a lower surface of the top ceramic disc, a bottom ceramic disc having a hole through the bottom ceramic disc, an upper bonding layer interposed between the lower surface of the top ceramic disc and an upper surface of the bottom ceramic disc, and a porous plug within at least one of the recess of the top ceramic disc and the hole of the bottom ceramic disc, a temperature control base, and a lower bonding layer interposed between a lower surface of the bottom ceramic disc and an upper surface of the temperature control base.