Multi-chamber Semiconductor Processing Device Segmentation
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Solution Overview
Problem
Traditional batch-type chemical processing and cleaning technologies face challenges in wafer surface processing uniformity, cross contamination, inadequate removal of ultra-micro particles, and damage to new materials with low and high dielectric constants, limiting the throughput of single-wafer chemical processing equipment compared to traditional multi-wafer batch-type processing.
Innovation Solution
A multi-chamber semiconductor processing apparatus with longitudinally distributed micro chambers on columns, allowing for simultaneous single-wafer chemical processing, featuring movable upper and lower chamber portions, drive devices, and micro drive components like helical extension springs, enabling efficient fluid flow and processing fluid supply and collection systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If traditional batch-type chemical processing and cleaning technologies are used, then multiple wafers can be processed at the same time, but wafer surface processing uniformity deteriorates and cross contamination occurs
Solution Approach 1:
The batch-type processing chamber is segmented into multiple independent single-wafer processing chambers arranged in parallel. Each chamber processes one wafer independently, eliminating cross-contamination between wafers while maintaining high throughput through simultaneous processing of multiple wafers across different chambers.
Solution Approach 2:
The system transitions from processing multiple wafers in the same spatial chamber (2D arrangement) to arranging multiple single-wafer chambers in a multi-chamber configuration (3D spatial distribution). This dimensional change allows independent processing environments for each wafer while maintaining high productivity.
2Productivity
If traditional batch-type chemical processing and cleaning technologies are used, then multiple wafers can be processed at the same time, but cross contamination between wafers occurs
Solution Approach 1:
The processing system is divided into multiple isolated single-wafer chambers, each with its own processing environment. This segmentation prevents contaminants from one wafer from affecting other wafers, eliminating cross-contamination while maintaining high throughput through parallel processing.
Solution Approach 2:
Each single-wafer chamber acts as an intermediary isolation barrier between wafers. The separate chambers with independent fluid supply and exhaust systems prevent direct interaction between wafers, eliminating cross-contamination pathways while allowing simultaneous processing of multiple wafers.
3Manufacturing precision
If single-wafer chemical processing equipment is used, then wafer surface processing uniformity and cleaning capability are improved, but throughput decreases compared to batch-type processing
Solution Approach 1:
Multiple single-wafer processing chambers are merged into a unified multi-chamber system that operates in parallel. Each chamber maintains the advantages of single-wafer processing (uniformity, cleaning capability) while the combined system achieves high throughput equivalent to or exceeding traditional batch processing.
Solution Approach 2:
The multi-chamber system enables continuous processing by having multiple chambers operate simultaneously at different stages of the processing sequence. While one chamber is processing, another is loading or unloading, eliminating idle time and maintaining continuous productive action across the system.
Data Source
AI summary
The present disclosure provides a multi-chamber semiconductor processing apparatus including at least two micro chambers for receiving and processing a semiconductor wafer. Each micro chamber includes an upper chamber portion defining an upper working surface and a lower chamber portion defining a lower working surface. The upper chamber portion and the lower chamber portion are relatively movable between an open position for loading or removing the semiconductor wafer and a closed position for receiving and processing the semiconductor wafer. Compared with the prior art, the multi-chamber semiconductor processing apparatus of the present disclosure are provided with a plurality of micro chambers in a longitudinal direction, which enables the multi-chamber semiconductor processing apparatus to carry out single-wafer chemical processing on a plurality of semiconductor wafers at the same time.