Multi-Channel Burn-In Test Pre-Test for Semiconductor Chips
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Solution Overview
Problem
Current burn-in test configurations for memory devices are unreliable due to contaminated connections between sockets and semiconductor chips, leading to inaccurate test results and time-consuming troubleshooting, as a single contaminated socket can affect multiple chips connected to the same electrical bus.
Innovation Solution
Implementing a semiconductor chip with a control circuit and multiple signal channels that reconfigure pins to receive test signals through separate channels, allowing for a pre-test to assess electrical connections before the burn-in test, thereby identifying and isolating contaminated connections and reducing the impact of faulty sockets.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple chips are connected to the same electrical bus in parallel to save time and costs, then test efficiency is improved, but test reliability deteriorates due to contaminated connections affecting multiple chips
Solution Approach 1:
The patent divides the signal transmission path into multiple independent channels (first signal channel and second signal channel), each with separate electrical buses. This segmentation isolates potential contamination to single channels, preventing it from affecting multiple chips simultaneously, thus maintaining test reliability while preserving multi-chip parallel testing efficiency.
2Reliability
If a pre-test is performed to check electrical connections before burn-in test, then test reliability is improved, but test time increases
Solution Approach 1:
The patent performs a pre-test before the main burn-in test to check electrical connections between pins and sockets. This preliminary action identifies contaminated connections early, preventing false failures during the time-consuming burn-in test. The pre-test uses multiple signal channels to verify connection integrity, ensuring that only chips with good connections proceed to burn-in testing, thereby improving overall test reliability while minimizing time loss through efficient connection validation.
3Measurement precision
If multiple signal channels are used for pre-test, then connection assessment accuracy is improved, but device complexity increases
Solution Approach 1:
The patent employs a control circuit that can reconfigure pins to function as multiple signal channels (first signal channel and second signal channel). This multi-functionality allows the same hardware pins to serve different testing purposes, achieving accurate connection assessment through multiple channels without proportionally increasing device complexity. The control circuit manages the reconfiguration, enabling precise connection verification while maintaining a relatively compact device structure.
Data Source
AI summary
The disclosure performs a pre-test that checks electrical connections between each electrical contact of the socket and the corresponding pin of the semiconductor chip during a pre-test stage before a burn-in test. The electrical connection between each of the electrical contacts and each of the pins may be checked through multiple signal channels. Even when one of the signal channels failed, the pre-test and the burn-in test may still be performed as long as another one of the signal channels passes the pre-test. In addition, the pre-test stage through multiple signal channels also provides information for determining whether the failure of semiconductor chip is caused by the electrical connection between the socket of the burn-in board or the semiconductor chip itself.