Multi-Channel Electronic Component Cooling for Heat Accumulation
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Solution Overview
Problem
Existing heat dissipation technologies for electronic components, such as air cooling, liquid cooling, and thermoelectric cooling, face challenges in efficiently removing heat generated by high-frequency operations, leading to potential overheating and damage to components due to inadequate heat transfer and high installation costs.
Innovation Solution
A device with a housing featuring a contact wall, heat dissipating wall, liquid inlet and outlet ports, partition walls, and flow guiding walls is designed to facilitate both liquid and air cooling, where the contact wall conducts heat to the flow guiding and heat dissipating walls, and the partition walls divide the housing into inflow and outflow channels to enhance heat absorption by the coolant, while fins increase air cooling efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If immersion type heat dissipation is used, then heat dissipation efficiency is improved, but installation and operation costs are extremely high
Solution Approach 1:
The device divides the housing into multiple flow channels (inflow channel, outflow channel, intermediate flow channel) using partition walls, creating segmented coolant flow paths that increase heat exchange efficiency without requiring complete immersion cooling
Solution Approach 2:
The patent transitions from three-dimensional immersion cooling to a structured multi-channel flow system with two-dimensional heat exchange surfaces, reducing complexity while maintaining effective heat dissipation
2Reliability
If heat dissipation fins are used, then heat dissipation capability is improved, but heat accumulation occurs due to one-dimensional heat conduction
Solution Approach 1:
The housing is segmented into multiple flow channels with partition walls, creating multi-path heat conduction routes that prevent heat accumulation by distributing thermal load across different channels
Solution Approach 2:
The patent enhances one-dimensional fin heat conduction by adding multi-dimensional coolant flow paths through partition walls and passages, creating a hybrid heat dissipation system that prevents thermal bottlenecks
3Temperature
If TEC chip is used, then cold surface temperature is reduced, but coldness is lost when hot surface heat is not quickly discharged
Solution Approach 1:
The device segments the heat discharge path into multiple parallel channels (inflow, intermediate, outflow channels) with increased surface area, enabling faster heat removal from the TEC chip hot surface to prevent thermal feedback
Solution Approach 2:
The coolant flow paths are pre-configured with partition walls and passages to maximize heat exchange surface area before heat accumulation occurs, ensuring immediate heat discharge capability when TEC chip is activated
4Reliability
If partition walls with passages are used, then coolant flow path is extended, but device structure becomes more complex
Solution Approach 1:
The partition walls serve multiple functions: they divide flow channels, create heat exchange surfaces, and incorporate passages for coolant flow, reducing the need for separate components and simplifying overall structure despite extended flow paths
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively prevents heat accumulation by simultaneously utilizing liquid and air cooling, ensuring efficient heat dissipation and maintaining the performance and lifespan of electronic components.
Implementation Method 1
the contact wall contacts the hot surface of the electronic component, and quickly conducts the heat generated by the electronic component to the flow guiding wall, the partition wall, the side wall and the heat dissipating wall
Implementation Method 2
the coolant flows into the housing through the liquid inlet port, passes through the inflow channel, the passages, the intermediate flow channel and the outflow channel to absorb the heat
Implementation Method 3
the fins on the heat dissipating wall of the housing increases the solid-gas heat exchange area, to conduct the remaining heat that is not absorbed by the coolant to the air
Data Source
AI summary
A device of drawing out surface heat of an electronic component includes a housing, a liquid inlet port, a liquid outlet port, a partition wall and flow guiding walls. The housing includes opposite a contact wall and a heat dissipating wall, and a side wall respectively connected to the contact wall and the heat dissipating wall. The liquid inlet port and the liquid outlet port are formed on the side wall. The partition wall is formed in the housing, and connected to inner surfaces of the contact wall, the heat dissipating wall and the side wall, to divide an interior of the housing into an inflow channel and an outflow channel. The flow guiding walls are respectively formed in the inflow channel and the out flow channel, and connected to the inner surface of the contact wall.