Multi-Channel Semiconductor Die Testing Probe System

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Solution Overview

Problem

Conventional semiconductor die testing methods often damage die during evaluation, leading to incorrect classification of good and defective die, and require multiple contact periods for multi-channel configurations, resulting in inefficiencies and increased production time.

Innovation Solution

A testing probe system that utilizes shared probe pads on multi-channel semiconductor die, allowing for the testing of multiple channels during a single continuous contact period, reducing the need for separate contact periods and minimizing die damage.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If conventional testing probe systems test each channel of multi-channel die separately, then testing accuracy is improved, but testing time increases and productivity decreases

Engineering Contradiction:

Improvetesting accuracyVSAvoidtesting time

Core Design Contradiction:

Measurement precisionVSProductivity

Solution Approach 1:

The patent combines multiple channel tests into a single contact period by implementing multi-channel testing capability. The probe system simultaneously contacts multiple pads and tests multiple channels of the die in one touchdown event, merging what were previously separate testing operations into a unified process that maintains accuracy while reducing time.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The probe system is designed with multi-functionality to handle multiple channels simultaneously. The system can configure probe contacts to test different channels through a single touchdown, making the testing apparatus universal enough to handle various channel configurations without requiring separate testing passes for each channel.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Reliability

If the number of contact periods is increased to test multiple channels, then testing completeness is improved, but die damage increases

Engineering Contradiction:

Improvetesting completenessVSAvoiddie damage

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

By merging multiple channel tests into a single contact period, the system reduces the total number of times probe needles must touchdown on the die. This consolidation maintains complete testing of all channels while minimizing the repetitive mechanical contact that causes damage to bond pads and under bump metallization.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The system implements continuous testing across multiple channels within a single contact period, eliminating the need to lift and re-contact the probe for each channel. This continuous action reduces the frequency of harmful touchdown events while maintaining complete test coverage.

Inventive Principle:

Principle #20Continuity of useful action

3Measurement precision

If separate contact periods are used for each channel, then channel evaluation accuracy is improved, but manufacturing efficiency decreases

Engineering Contradiction:

Improvechannel evaluation accuracyVSAvoidmanufacturing efficiency

Core Design Contradiction:

Measurement precisionVSProductivity

Solution Approach 1:

The patent merges the evaluation of multiple channels into a single integrated contact period. The probe system simultaneously contacts multiple pads and evaluates multiple channels in one operation, maintaining the accuracy needed for proper channel assessment while dramatically improving manufacturing efficiency by reducing the total testing time per die.

Inventive Principle:

Principle #5Merging (Combining)

4Productivity

If conventional probe systems are modified to test multi-channel die faster, then productivity is improved, but device complexity increases

Engineering Contradiction:

Improvetesting speedVSAvoidsystem modification complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

The probe system is designed with inherent multi-functionality that allows it to test multiple channels simultaneously without requiring complex modifications. By configuring the probe contacts and control logic to handle multi-channel configurations, the system achieves faster testing speeds while maintaining relatively simple architecture.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The system implements dynamic channel configuration capability, allowing the same probe system to adapt to different channel configurations (single-channel, dual-channel, etc.) through software or control logic adjustments rather than physical reconfiguration. This dynamic adaptability enables faster testing without increasing hardware complexity.

Inventive Principle:

Principle #15Dynamics

Data Source

PatentUS11555828B2Testing probe system for testing semiconductor die, multi-channel die having shared pads, and related systems and methods

Publication Date: 2023.01.17 MICRON TECHNOLOGY INC

AI summary

A testing probe system includes probes configured to contact shared probe pads of multi-channel die of a wafer; and a controller configured to generate testing patterns and receive signals from the multi-channel die of the wafer. The controller is configured to contact a probe of the probes with a shared probe pad of the multi-channel die, select a first channel of the multi-channel die to test, select at least one test mode for testing the first channel, stimulate at least the first channel during a single contact period, acquiring a first output of the first channel during the single contact period, select a second channel of the multi-channel die to test, select at least one test mode for testing the second channel, stimulate at least the second channel during the single contact period, and acquire a second output of the first channel during the single contact period.