Monolithic Multi-Channel Protection Structure for Surge and ESD
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Solution Overview
Problem
Current semiconductor technologies are inadequate in providing effective multi-channel protection for electronic circuit components against transient voltage surges and electrostatic discharge.
Innovation Solution
A monolithic multiple-channel protection device is designed, featuring semiconductor chips conductively coupled to leads and substrate layers, with fill layers encapsulating the components for enhanced protection, allowing for surface mounting and improved impulse surge protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If existing semiconductor technologies are used, then single-channel protection is provided, but multi-channel protection capability is insufficient
Solution Approach 1:
The patent combines multiple semiconductor chips (first semiconductor chip and second semiconductor chip) into a single integrated device with multiple leads, creating a multi-channel protection device that provides both multi-channel capability and reliable protection simultaneously
2Adaptability or versatility
If multiple semiconductor chips are used for multi-channel protection, then protection coverage is improved, but device complexity increases
Solution Approach 1:
Multiple semiconductor chips are integrated into a single packaged device with a unified structure including substrate, encapsulant, and common lead arrangements, reducing the complexity of implementing multi-channel protection by providing an integrated solution rather than separate components
Solution Approach 2:
The device structure is designed to support multiple channels with different semiconductor chips while using common structural elements (substrate, encapsulant, lead framework), allowing the same physical structure to serve multiple protection functions simultaneously
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device effectively protects electronic components from transient voltage surges and electrostatic discharge by providing enhanced impulse surge protection through its multi-channel configuration and encapsulation, addressing the limitations of existing semiconductor technologies.
Implementation Method 1
A first semiconductor chip may be configured to be conductively coupled to the first chip attachment portion and the third chip attachment portion. A second semiconductor chip may be configured to be conductively coupled to the second chip attachment portion and the fourth chip attachment portion.
Implementation Method 2
A first fill layer may be configured to be formed for encapsulating the first semiconductor chip, the first chip attachment portion and the third chip attachment portion. A second fill layer may be configured to be formed for encapsulating the second semiconductor chip, the second chip attachment portion and the fourth chip attachment portion.
Data Source
AI summary
A multiple-channel protection device and associated methods thereof. The device includes a first lead having a first chip attachment portion and a second chip attachment portion, a second lead having a third chip attachment portion, and a third lead having a fourth chip attachment portion. A first semiconductor chip is configured to be conductively coupled to the first chip attachment portion and the third chip attachment portion. A second semiconductor chip is configured to be conductively coupled to the second chip attachment portion and the fourth chip attachment portion.