Multi-Channel Heat Sink With Sectional Wall For High-Power Cooling
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat sink designs are inadequate for dissipating heat from high-power electronic components, as they often fail to provide sufficient thermal performance due to inadequate fluid flow management and surface area distribution.
Innovation Solution
A novel heat sink design featuring a sectional wall that separates the fin field into multiple sections with distinct fluid inlets and exits, allowing for controlled fluid flow management and enhanced thermal performance by preventing fluid mixing and optimizing flow distribution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If traditional plate fin heat exchangers are used, then cost and implementation are simplified, but thermal performance is insufficient for high-power electronic components
Solution Approach 1:
The heat exchanger is divided into multiple flow channels separated by partition walls, with each channel containing a stack of plates with flow passages. This segmentation allows independent optimization of each flow channel while maintaining manufacturing simplicity through modular plate assembly.
Solution Approach 2:
The invention transitions from conventional two-dimensional plate fin structures to a three-dimensional multi-channel configuration with plates stacked in layers. This adds a vertical dimension to heat transfer, significantly increasing the effective heat exchange surface area within the same footprint volume.
2Device complexity
If conventional heat sink designs are used, then structural simplicity is maintained, but surface area relative to volume is limited
Solution Approach 1:
Multiple plates are nested within each other in a stacked configuration, with each plate containing flow passages that align with adjacent plates. This nesting creates a compact multi-layer structure that maximizes surface area density while maintaining a simple external form factor.
Solution Approach 2:
The heat exchanger utilizes the vertical stacking dimension to multiply surface area. Instead of expanding horizontally with larger fins, the design stacks plates vertically to create multiple heat transfer surfaces within the same footprint, effectively increasing surface area relative to volume.
3Device complexity
If single flow channel heat sinks are used, then fluid flow management is simple, but heat dissipation efficiency is insufficient
Solution Approach 1:
The fluid flow path is segmented into multiple independent channels separated by partition walls. Each channel receives coolant from a common inlet manifold and directs flow through stacked plates to a common outlet manifold. This segmentation enables parallel heat dissipation across multiple channels, significantly improving overall heat dissipation efficiency.
Solution Approach 2:
The manifold structure serves multiple functions: distributing coolant to multiple channels, collecting coolant from all channels, and providing structural support for the plate stack. This multi-functionality enables complex multi-channel flow management without proportionally increasing system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively increases thermal performance by minimizing pressure drop and ensuring efficient heat dissipation from high-power electronic components, making it suitable for applications where traditional heat sinks may fail.
Implementation Method 1
Through forced or natural convention, fluid circulation around the fin array acts as the heat transfer medium for cooling the device to an operable temperature
Implementation Method 2
The base is placed in intimate contact with the heat-producing device to provide a conduction path to the fin array
Data Source
AI summary
Embodiments of the invention related to using the fin length of the heat sink extending from an entrance of the heat sink to an interior sectional wall as the heat transfer element to achieve high thermal performance. The sectional wall(s) of the heat sink function to isolate fluid flow communication between the heat sink sections of fin fields, thereby preventing a flow coupling between the fin fields.