Thermal management integration module and electric vehicle

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Solution Overview

Problem

Conventional electric vehicle thermal management systems face issues with dispersed thermal management components that occupy large space, require complex and lengthy cooling pipelines, leading to increased system resistance, heat leakage, and higher costs.

Innovation Solution

A thermal management integration module utilizing a multi-channel integration board to integrate thermal management components, optimizing cooling and air conditioning pipelines for reduced space, weight, and cost, with a modular design for efficient supplier management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If thermal management components are arranged in a dispersed manner, then each component can be independently designed and maintained, but the arrangement space occupied increases and the system complexity increases

Engineering Contradiction:

ImproveIndependent component design and maintenanceVSAvoidArrangement space

Core Design Contradiction:

Ease of manufactureVSArea of stationary object

Solution Approach 1:

The patent integrates multiple thermal management components (water pump, expansion tank, heat exchanger, condenser, temperature sensors, solenoid valves, and cooling pipelines) into a single integrated thermal management module. This merging approach reduces the overall arrangement space while maintaining independent functionality of each component through modular design within the integration board.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The integration board serves multiple functions simultaneously: it acts as a structural carrier for mounting components, provides cooling pipelines for thermal management, incorporates storage cavities for refrigerant or coolant, and enables compact arrangement of multiple components. This multi-functionality reduces the need for separate structural elements and minimizes overall space occupation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Ease of manufacture

If thermal management components are arranged in a dispersed manner, then each component can be independently designed, but the number of cooling pipelines increases leading to complex arrangement and higher costs

Engineering Contradiction:

ImproveIndependent component designVSAvoidCooling pipeline arrangement

Core Design Contradiction:

Ease of manufactureVSDevice complexity

Solution Approach 1:

Multiple cooling pipelines are integrated into the integration board structure, with pipelines routed through dedicated channels and cavities within the board itself. This combines what would otherwise be separate external piping into a unified internal structure, simplifying the overall arrangement and reducing the number of discrete pipeline components needed.

Inventive Principle:

Principle #5Merging (Combining)

3Quantity of substance

If the number of cooling pipelines is increased to connect dispersed thermal management components, then all components can be connected, but the system flow resistance increases and heat leakage value increases

Engineering Contradiction:

ImproveNumber of connectionsVSAvoidSystem flow resistance and heat leakage

Core Design Contradiction:

Quantity of substanceVSLoss of energy

Solution Approach 1:

Cooling pipelines are nested within the integration board structure, with multiple pipeline channels embedded in the board's thickness. This nesting approach allows multiple connections to be made within a compact volume, reducing the overall length of pipelines exposed to the environment and minimizing heat leakage while maintaining adequate flow paths.

Inventive Principle:

Principle #7Nested doll (Nesting)

4Quantity of substance

If dispersed thermal management components are connected with longer cooling connection pipelines, then all components can be connected, but the system flow resistance increases requiring higher power water pump

Engineering Contradiction:

ImproveComponent connectivityVSAvoidWater pump power

Core Design Contradiction:

Quantity of substanceVSPower

Solution Approach 1:

The integration board merges multiple connection functions into a single compact structure, allowing all thermal management components to be connected with minimal pipeline length. By consolidating the water pump, heat exchanger, condenser, and other components within the same integration module, the patent reduces the total pipeline length and associated flow resistance, thereby reducing the power requirement of the water pump.

Inventive Principle:

Principle #5Merging (Combining)

Data Source

PatentUS12420610B2Thermal management integration module and electric vehicle

Publication Date: 2025.09.23 ZHEJIANG GEELY HLDG GRP CO LTD

AI summary

Provided is a thermal management integration module (100) and an electric vehicle. The thermal management integration module (100) includes: a multi-channel integration board (110) having a plurality of cooling connection pipelines (111) formed therein, the multi-channel integration board (110) being configured as a carrier member for the thermal management integration module (100); and at least two thermal management components mounted on the multi-channel integration board (110) and connected to each other by the plurality of cooling connection pipelines (111). The design of the multi-channel integration board can not only serve as a connection channel between different thermal management components, but also serve as a carrier member for the entire integration module to enable the thermal management components to be integrated on the multi-channel integration board, forming the thermal management integration module with low costs, a light weight, and a small arrangement space.