Multi-channel semiconductor package with discrete signal paths
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Solution Overview
Problem
Current semiconductor devices face challenges in processing large amounts of data efficiently while being compact and reliable, with a need for higher integration, performance, and speed, particularly in electronic systems that require multiple channels for signal transmission.
Innovation Solution
A multi-channel package design featuring a package substrate with multiple semiconductor chips and external connection terminals, where each channel is discrete and independent, allowing signals to be transmitted to/from semiconductor chips via dedicated paths, enhancing operational speed and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple semiconductor chips are highly integrated into a single package to process large amounts of data, then the data processing capability is improved, but the signal transmission reliability deteriorates due to potential defects affecting multiple chips
Solution Approach 1:
The patent divides the package into multiple independent channels, where each channel is associated with a specific semiconductor chip and provides a dedicated signal transmission path. This segmentation ensures that defects in one chip do not affect signal transmission to other chips, thereby maintaining reliability while enabling high integration of multiple chips for enhanced data processing capability.
2Speed
If multiple channels are used for signal transmission to enhance operational speed, then the processing speed is improved, but the device complexity increases due to multiple independent paths
Solution Approach 1:
The package structure is segmented into multiple channels, with each channel providing an independent signal transmission path associated with a specific semiconductor chip. This segmentation enables parallel signal transmission across multiple channels, thereby enhancing operational speed while maintaining manageable complexity through modular organization.
Solution Approach 2:
Each channel in the package is designed to perform multiple functions: it provides dedicated signal transmission for its associated semiconductor chip, enables independent operation, and can be selectively activated based on system requirements. This multi-functionality allows the package to achieve high operational speed through parallel processing while keeping the overall structure versatile and adaptable.
3Reliability
If discrete independent channels are provided for each chip, then the signal transmission independence is improved, but the manufacturing complexity increases
Solution Approach 1:
The package is segmented into multiple channels, with each channel providing discrete and independent signal transmission paths for associated semiconductor chips. This segmentation ensures that signal transmission for each chip remains independent and unaffected by defects in other chips, thereby improving reliability while enabling systematic manufacturing approaches.
Solution Approach 2:
Multiple semiconductor chips and their associated channels are combined into a single integrated package structure. This merging approach allows the benefits of discrete independent channels (signal transmission independence) to be achieved while simplifying manufacturing by treating the entire multi-channel system as a unified assembly rather than separate components.
Data Source
AI summary
A multi-channel package has at least four channels and includes a package substrate having a first surface and a second surface, semiconductor chips mounted on the first surface of the package substrate, and external connection terminals disposed on the second surface of the package substrate and electrically connected to the semiconductor chips by the at least four channels. Each channel is dedicated to one or a group of the chips. An electronic system includes a main board, at least one such multi-channel package mounted on the main board, and a controller package that is mounted on the main board, has 4n channels (wherein n≧2) and controls the at least one multi-channel package.