Multi-Charged-Particle Beam Writing via Movable Aperture Substrates
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Solution Overview
Problem
In multi-beam writing apparatuses, adjusting the sizes and current amounts of charged particle beams without reconfiguring lens conditions is challenging, leading to difficulties in achieving high throughput and maintaining writing accuracy due to Coulomb repulsion among beams.
Innovation Solution
A multi-charged-particle beam writing apparatus and method that utilize a first and second shaping aperture array substrate, a blanking aperture array, and a movable mechanism to adjust beam sizes and current amounts by relative movement of these substrates based on current measurement, allowing for independent control of each beam without adjusting lens conditions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the current amount of each beam is increased to improve throughput, then the writing time is shortened, but the Coulomb repulsion between beams increases and writing accuracy deteriorates
Solution Approach 1:
The invention divides the beam control into two independent stages: beam formation through aperture arrays and beam size adjustment through movable substrates. This segmentation allows current amount to be increased for throughput while beam size is independently controlled to maintain accuracy, resolving the contradiction between productivity and manufacturing precision.
Solution Approach 2:
The invention introduces movable substrate mechanisms that dynamically adjust beam sizes by changing the relative positions between aperture arrays. This dynamic adjustment capability allows the system to optimize beam parameters for different writing scenarios, enabling high current amounts for speed while maintaining precise beam size control for accuracy.
2Ease of operation
If lens conditions are adjusted to control beam sizes and current amounts, then individual beam characteristics can be controlled, but the adjustment time increases and throughput decreases
Solution Approach 1:
The invention replaces the traditional mechanical lens adjustment system with a movable substrate mechanism. Instead of adjusting lens conditions to control beam parameters, the system physically moves the substrate containing aperture arrays relative to the beam path. This substitution eliminates time-consuming lens adjustments while maintaining precise beam control capability.
Solution Approach 2:
The movable substrate mechanism serves multiple functions: it controls beam size, adjusts beam position, and optimizes beam formation simultaneously. This multi-functionality replaces what previously required separate lens adjustments for each parameter, improving ease of operation without sacrificing throughput.
3Manufacturing precision
If current density is switched for different mask patterns to maintain accuracy, then writing accuracy can be maintained, but the lens adjustment process reduces throughput
Solution Approach 1:
The invention performs preliminary beam formation and size optimization through the aperture array configuration before writing begins. The movable substrate is pre-positioned to achieve the desired beam parameters, eliminating the need for current density switching during the writing process. This preliminary action maintains writing accuracy while preserving throughput.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient adjustment of beam sizes and current amounts, improving throughput and accuracy by minimizing Coulomb repulsion and reducing the time required for lens reconfiguration, thereby enhancing the overall writing process.
Implementation Method 1
an emitter emitting a charged particle beam
Implementation Method 2
a movable mechanism moving at least one of the first shaping aperture array substrate and the second shaping aperture array substrate
Data Source
AI summary
Provided is a multi-charged-particle beam writing apparatus including: an emitter emitting a charged particle beam; a first shaping aperture array substrate having a plurality of first apertures and forming first multiple beams by passing a part of the charged particle beam through the first apertures, respectively; a second shaping aperture array substrate having second apertures formed at positions corresponding to the respective first apertures and forming second multiple beams by passing at least a part of each of the first multiple beams through corresponding the second apertures, respectively; a blanking aperture array having third apertures formed at positions corresponding to the respective second apertures and including blankers disposed in the respective third apertures to perform blanking deflection on the respective beams of the corresponding second multiple beams; a movable mechanism moving at least one of the first shaping aperture array substrate and the second shaping aperture array substrate; and a controller controlling the movable mechanism.