Multi-Chip Bonding Head With Adjustable Chip Spacing

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Solution Overview

Problem

Conventional semiconductor packaging methods face challenges in efficiently bonding multiple chips to a carrier substrate with precision, leading to reduced productivity and increased equipment time due to the need for individual handling and flip-chip bonding processes.

Innovation Solution

A chip bonding apparatus with a bonding head featuring multiple chip holding units that can adjust intervals between chips, allowing for precise and simultaneous bonding of multiple chips to a target surface using a multi-chip bonding method.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a single chip bonding method is used to transfer and bond chips one by one, then manufacturing precision can be maintained, but productivity is significantly reduced and equipment operation time increases

Engineering Contradiction:

Improvechip bonding precisionVSAvoidchip bonding speed

Core Design Contradiction:

Manufacturing precisionVSProductivity

Solution Approach 1:

The bonding head is divided into multiple chip holding units (first, second, third, and fourth units) that can independently hold and position chips. This segmentation allows simultaneous handling of multiple chips while maintaining individual precision control for each unit, resolving the contradiction between bonding precision and productivity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Multiple chip holding units are integrated into a single bonding head that operates simultaneously. The bonding head combines multiple chip handling functions in one device, enabling parallel bonding operations while maintaining the precision of individual chip placement through coordinated control of each holding unit.

Inventive Principle:

Principle #5Merging (Combining)

2Reliability

If chips are flipped upside down for flip chip type bonding, then bonding reliability is improved, but time consumption and process difficulty increase

Engineering Contradiction:

Improvebonding reliabilityVSAvoidchip bonding time

Core Design Contradiction:

ReliabilityVSLoss of time

Solution Approach 1:

Chips are pre-flipped upside down in the chip holding units before bonding occurs. The first and second chip holding units hold chips with their back surfaces upward, while the third and fourth units hold chips with their front surfaces upward, allowing flip chip bonding to proceed without additional time-consuming flipping operations during the bonding process itself.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The chip holding units are designed to dynamically adjust chip orientation and position. The bonding head can move different chip holding units independently in different directions, enabling flexible chip positioning and flipping operations that reduce overall process time while maintaining bonding reliability.

Inventive Principle:

Principle #15Dynamics

3Productivity

If multiple chips are bonded simultaneously to increase productivity, then manufacturing efficiency improves, but controlling precise intervals between chips becomes more difficult

Engineering Contradiction:

Improvechip bonding throughputVSAvoidchip interval control

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The bonding head is designed with universal chip holding units that can simultaneously perform multiple functions: holding chips, positioning them at precise intervals, and bonding them to the carrier substrate. Each holding unit can be independently controlled to achieve the required interval precision while maintaining high throughput through simultaneous operations.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent replaces traditional mechanical positioning systems with a more advanced coordination system that controls the movement and positioning of multiple chip holding units. This system uses coordinated control mechanisms to maintain precise intervals between chips during simultaneous bonding operations, achieving both high productivity and manufacturing precision.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Data Source

PatentUS20250219012A1Chip bonding apparatus for semiconductor packaging and semiconductor packaging method using the same

Publication Date: 2025.07.03 SILICON BOX PTE LTD

AI summary

Disclosed are a chip bonding apparatus for semiconductor packaging and a semiconductor packaging method using the same. The chip bonding apparatus may include a bonding head, wherein the bonding head may include a plurality of chip holding units, each of which is configured to individually hold a chip, and the bonding head may be configured to adjust the interval between the plurality of chip holding units. The chip bonding apparatus may be configured to bond a plurality of chips to a given target surface at controlled intervals using the plurality of chip holding units according to a multi-chip bonding method. The semiconductor packaging method may include bonding chips to a target surface of a carrier substrate at controlled intervals using the plurality of chip holding units according to the multi-chip bonding method.