Multi-Chip Bump Structures for Heterogeneous Packaging

Resolve Bottlenecks,
Find Innovative SolutionsGenerate Solutions

Solution Overview

Problem

Current chip packaging technologies face challenges in bonding chips with different bump sizes on a single substrate, as the manufacturing process becomes more complicated and expensive with increasing numbers of different sized bumps, and not all manufacturers have the capability to produce smaller micro-bumps required for advanced packaging.

Innovation Solution

The solution involves forming bump structures by aligning and bonding larger bumps on chips with multiple smaller micro-bumps on a substrate, where the smaller bumps share the burden of carrying current and provide a stronger connection, allowing chips with varying bump sizes to be packaged together by reflowing solder between aligned bumps.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If multiple different sized bumps are used on a substrate to accommodate chips with varying bump sizes, then the adaptability of the packaging system is improved, but the device complexity and manufacturing cost increase

Engineering Contradiction:

Improveability to package chips with different bump sizesVSAvoidmanufacturing process complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The invention divides a single large bump into multiple smaller micro-bumps (e.g., four 20-micron micro-bumps instead of one 40-micron bump). This segmentation allows the substrate to use uniform small micro-bumps for all chip connections, while chips with different bump sizes can be accommodated by matching their bumps to appropriate groups of micro-bumps. The segmentation resolves the contradiction by enabling adaptability through standardized small units rather than requiring multiple different sized bump types.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Instead of making the substrate accommodate different sized bumps directly (which increases complexity), the invention inverts the approach by having the substrate use only small micro-bumps and allowing larger chip bumps to connect to multiple micro-bumps simultaneously. This inversion simplifies the substrate manufacturing while maintaining the ability to package chips with varying bump sizes.

Inventive Principle:

Principle #13The other way round (Inversion)

2Productivity

If smaller micro-bumps are used to increase connection density, then the productivity and electrical connection capability are improved, but the manufacturing capability requirements increase

Engineering Contradiction:

Improveelectrical connection capabilityVSAvoidmanufacturing capability

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The invention combines multiple small micro-bumps into a single bonding unit that connects to one larger chip bump. For example, four 20-micron micro-bumps are bonded together to form a single connection point that interfaces with a 40-micron chip bump. This merging approach enables high connection density and electrical capability through multiple parallel connections, while the manufacturing process remains feasible because the micro-bumps are formed using standard semiconductor fabrication processes.

Inventive Principle:

Principle #5Merging (Combining)

3Ease of manufacture

If larger bumps are used on chips, then the ease of manufacture is improved, but the connection strength and current carrying capacity are reduced

Engineering Contradiction:

Improvechip manufacturing easeVSAvoidconnection strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The invention transitions from a single-dimension connection (one large bump to one large bump) to a multi-dimensional connection where multiple small micro-bumps connect to one large chip bump. This dimensional change allows the connection strength and current carrying capacity to be increased through parallel multiple connections, while the chip manufacturing remains easy because it uses the chip's existing large bump structure without requiring modification.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach enables the efficient packaging of chips with different bump sizes on a common substrate, reducing manufacturing complexity and cost, while ensuring reliable electrical connections, thereby improving the package form factor and functionality of multi-chip devices.

Implementation Method 1

reflowing solder between aligned bumps

Methodology Applied

Scientific EffectSoldering: Soldering

Implementation Method 2

reflowing solder between aligned bumps

Methodology Applied

Scientific EffectHeating: Heating

Data Source

PatentUS9837370B2Bump structures for multi-chip packaging

Publication Date: 2017.12.05 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD

AI summary

A multi-chip package includes a substrate having a plurality of first bump structures. A pitch between first bump structures of the plurality of first bump structures is uniform across a surface of the substrate. The multi-chip package includes a first chip bonded to the substrate and a second chip bonded to the substrate. The first chip includes a plurality of second bump structures, and the plurality of second bump structures are bonded to a first set of first bump structures of the plurality of first bump structures. The second chip includes a plurality of third bump structures, and the plurality of third bump structures are bonded to a second set of first bump structures of the plurality of first bump structures. A pitch between second bump structures of the plurality of second bump structures is different from a pitch between third bump structures of the plurality of third bump structures.