Thermally Enhanced Structure for Multi-Chip Device Heat Dissipation
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Solution Overview
Problem
Three-dimensional integrated circuits (3D ICs) face thermal performance issues due to excessive heat generation from densely packed semiconductor dies, which can decrease the thermal performance and reliability of the devices.
Innovation Solution
A thermally enhanced structure for multi-chip semiconductor devices is introduced, featuring a heat sink formed from conductive materials like copper, silver, or gold, strategically placed underneath the semiconductor die to dissipate heat, with a design that includes thermal vias and openings to facilitate balanced heat distribution and maintain electrical connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If semiconductor dies are densely packed in 3D IC to increase integration density, then productivity and performance are improved, but excessive heat is generated which worsens thermal performance
Solution Approach 1:
The patent transitions from planar heat dissipation to three-dimensional heat management by forming heat sinks that extend vertically from the substrate. These heat sinks create additional thermal dissipation pathways in the vertical dimension, allowing heat to be conducted away from densely packed dies through elevated structures rather than relying solely on the substrate plane.
Solution Approach 2:
The patent introduces heat sink structures as intermediary thermal management components between the semiconductor dies and the substrate. These heat sinks act as thermal mediators that intercept heat from multiple dies and conduct it to dedicated thermal vias, preventing direct heat accumulation at the die-substrate interface and enabling more efficient heat distribution.
2Temperature
If heat sinks are formed underneath semiconductor dies to dissipate heat, then thermal performance is improved, but device complexity increases
Solution Approach 1:
The patent divides the thermal management function into discrete heat sink structures, each associated with specific semiconductor dies. Rather than creating a monolithic complex cooling system, the heat sinks are segmented into multiple independent units that can be individually formed and positioned, simplifying the overall manufacturing process while maintaining effective thermal management.
Solution Approach 2:
The heat sink structures serve multiple functions simultaneously: they provide thermal conduction pathways, act as mechanical support structures, and enable electrical isolation between dies. This multi-functionality reduces the need for separate components, thereby managing device complexity while achieving improved thermal performance.
3Temperature
If thermal vias are used to conduct heat away from dies, then heat dissipation is improved, but electrical connectivity may be disrupted
Solution Approach 1:
The patent segments thermal vias and electrical vias into distinct, non-overlapping pathways. Thermal vias are positioned within heat sink structures to conduct heat away, while electrical vias are routed through separate regions to maintain signal integrity. This spatial segmentation prevents thermal management activities from interfering with electrical connectivity.
Solution Approach 2:
The patent applies different material properties and structural characteristics to different regions: heat sink areas use highly thermally conductive materials with thermal vias for heat dissipation, while circuit areas maintain original electrical properties with electrical vias for signal transmission. This local differentiation ensures that thermal management enhances heat dissipation without compromising electrical connectivity in functional regions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The implementation of the heat sink effectively reduces the junction temperature of semiconductor dies, enhancing the reliability and performance of 3D ICs by efficiently dissipating heat and maintaining electrical connections, thereby improving thermal performance.
Implementation Method 1
a heat sink formed from conductive materials like copper, silver, or gold, strategically placed underneath the semiconductor die to dissipate heat
Implementation Method 2
a design that includes thermal vias and openings to facilitate balanced heat distribution
Data Source
AI summary
A multi-chip semiconductor device comprises a thermally enhanced structure, a first semiconductor chip, a second semiconductor chip, an encapsulation layer formed on top of the first semiconductor chip and the second semiconductor chip. The multi-chip semiconductor device further comprises a plurality of thermal vias formed in the encapsulation layer. The thermally enhanced structure comprises a heat sink block attached to a first semiconductor die. The heat sink block may further comprise a variety of thermal vias and thermal openings. By employing the thermal enhanced structure, the thermal performance of the multi-chip semiconductor device can be improved.